| Properties of PEG, PPG and their copolymers: influence on copper filling of damascene interconnects K Ryan, K Dunn, J van Eisden, J Adolf Journal of The Electrochemical Society 160 (12), D3186, 2013 | 30 | 2013 |
| Development of electrochemical copper deposition screening methodologies for next generation additive selection K Ryan, K Dunn, J van Eisden Microelectronic engineering 92, 91-94, 2012 | 10 | 2012 |
| 3D CMOL Crossnet for Neuromorphic Network Applications K Ryan, S Tanachutiwat, W Wang Nano-Net: Third International ICST Conference, NanoNet 2008, Boston, MA, USA …, 2009 | 4 | 2009 |
| Development of electrochemical copper deposition screening methodologies for next generation additive selection K Ryan, K Dunn, J van Eisden MRS Online Proceedings Library (OPL) 1335, mrss11-1335-o09-27, 2011 | 1 | 2011 |
| Influence of Polyalkyl Glycol Polymers On Copper Filling of Damascene Interconnects K Ryan, KA Dunn, J van Eisden, JD Adolf ECS Meeting Abstracts, 2386, 2013 | | 2013 |
| Properties of PEG, PPG and their copolymers influence on the gap-fill characteristics of damascene interconnects KJ Ryan State University of New York at Albany, 2013 | | 2013 |
| Effects of Suppressor Properties on the Gap-Fill Process in Damascene Interconnects K Ryan, K Dunn, J van Eisden, J Adolf | | |
