受强制性开放获取政策约束的文章 - Jinesh Narangaparambil了解详情
无法在其他位置公开访问的文章：37 篇
Print process development for Ag-ink thermoformable conductive traces utilizing direct write technique for in-mold printed electronics
P Lall, MG Sarwar, J Narangaparambil, S Miller
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical …, 2023
强制性开放获取政策： US Department of Defense
Effect of sintering temperature on the fatigue life of additively printed electronics during cyclic bending
P Lall, J Narangaparambil, B Leever, S Miller
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019
强制性开放获取政策： US Department of Defense
Component Attach Process Recipe and Performance on Aerosol Printed Sustainable Silver Ink
P Lall, S Bimali, J Narangaparambil, S Miller
International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023
强制性开放获取政策： US Department of Defense
Sustainable Silver Ink Process Study on Low-Temperature Flexible Substrates
P Lall, F Musa, J Narangaparambil, S Miller
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical …, 2023
强制性开放获取政策： US Department of Defense
Printed Flexible LC Filter Using Additive Micro-Dispensing With Silver Conductive Paste and ECA for Component Attachment
P Lall, J Narangaparambil, K Schulze, S Miller
International Electronic Packaging Technical Conference and Exhibition 85505 …, 2021
强制性开放获取政策： US Department of Defense
Sintering process conditions for additive printing of multi-layer circuitry aerosol-jet process in conjunction with nanoparticle ink
P Lall, J Narangaparambil, V Soni, S Miller
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020
强制性开放获取政策： US Department of Defense
Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications
P Lall, J Narangaparambil, S Miller
International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022
强制性开放获取政策： US Department of Defense
Comparative Study of SMD Components Attached Using Electrically Conductive Adhesive and Magnetically Oriented Anisotropic Conductive Adhesive on Inkjet Printed Structures
P Lall, S Kulkarni, J Narangaparambil, S Miller
International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023
强制性开放获取政策： US Department of Defense
Printed flexible LC filter using the micro-dispensing technique using silver conductive pasted and ECA for component attachment
P Lall, J Narangaparambil, K Schulze, S Miller
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021
强制性开放获取政策： US Department of Defense
Effect of use parameters on fatigue-life of flexible substrates under bending loads
P Lall, J Narangaparatnbil, B Leever, S Miller
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019
强制性开放获取政策： US Department of Defense
Evaluation of Thermoformability of Additively Printed Circuits Printed Using Gravure Offset Printing Technique and Investigation of In-Mold Electronic Circuits
P Lall, V Soni, J Narangaparambil, S Miller
International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023
强制性开放获取政策： US Department of Defense
Performance of Component Interconnection Methods on Direct Write Additive Silver Circuits
P Lall, J Narangaparambil, S Miller
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022
强制性开放获取政策： US Department of Defense
Process-Reliability Relationships of SnBiAg and SnIn Solders for Component Attachment on Flexible Direct-Write Additive Circuits in Wearable Applications
P Lall, J Narangaparambil, S Miller
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1172-1183, 2022
强制性开放获取政策： US Department of Defense
Interconnection of Passive Components using Printed Aerosol-Jet Traces
P Lall, J Narangaparambil, K Schulze, S Miller
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021
强制性开放获取政策： US Department of Defense
Sustainable-Ink Process Recipes for the Fabrication of Additively Printed Circuits and Component Attachment
P Lall, J Narangaparambil, V Soni, S Kulkarni, K Goyal, S Miller
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 404-411, 2023
强制性开放获取政策： US Department of Defense
Influence of Component Interconnect with Printed Copper Circuits on Realized Mechanical and Electrical Characteristics in FHE Applications
P Lall, J Narangaparambil, S Miller
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022
强制性开放获取政策： US Department of Defense
Flexible encapsulation process-property relationships for flexible hybrid electronics
P Lall, P Choudhury, J Narangaparambil, S Miller
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1490-1499, 2021
强制性开放获取政策： US Department of Defense
Process Development for Printing Z-Axis Interconnects in Multilayered Flexible Substrates
P Lall, V Soni, J Narangaparambil, K Schulze, S Miller
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020
强制性开放获取政策： US Department of Defense
Process Development for Additive Fabrication of Z-Axis Interconnects In Multilayer Circuits
P Lall, N Kothari, K Goyal, J Narangaparambil, S Miller
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020
强制性开放获取政策： US Department of Defense
Functional Circuit Performance of Printable Formable Inks for In-Mold Electronics Applications
P Lall, J Narangaparambil, V Soni, S Miller
International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023
强制性开放获取政策： US Department of Defense
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