| Critical interlayer thickness for transient liquid phase bonding in the Cu–Sn system NS Bosco, FW Zok Acta Materialia 52 (10), 2965-2972, 2004 | 252 | 2004 |
| Evaluation of high‐temperature exposure of photovoltaic modules S Kurtz, K Whitfield, G TamizhMani, M Koehl, D Miller, J Joyce, ... Progress in photovoltaics: Research and applications 19 (8), 954-965, 2011 | 208 | 2011 |
| Strength of joints produced by transient liquid phase bonding in the Cu–Sn system NS Bosco, FW Zok Acta materialia 53 (7), 2019-2027, 2005 | 143 | 2005 |
| Evaluation of high-temperature exposure of rack-mounted photovoltaic modules S Kurtz, K Whitfield, D Miller, J Joyce, J Wohlgemuth, M Kempe, N Dhere, ... 2009 34th IEEE Photovoltaic Specialists Conference (PVSC), 002399-002404, 2009 | 109 | 2009 |
| Climate specific thermomechanical fatigue of flat plate photovoltaic module solder joints N Bosco, TJ Silverman, S Kurtz Microelectronics Reliability 62, 124-129, 2016 | 95 | 2016 |
| Test-to-failure of crystalline silicon modules P Hacke, K Terwilliger, S Glick, D Trudell, N Bosco, S Johnston, S Kurtz 2010 35th IEEE Photovoltaic Specialists Conference, 000244-000250, 2010 | 83 | 2010 |
| Assessing the causes of encapsulant delamination in PV modules JH Wohlgemuth, P Hacke, N Bosco, DC Miller, MD Kempe, SR Kurtz 2016 IEEE 43rd Photovoltaic Specialists Conference (PVSC), 0248-0254, 2016 | 59 | 2016 |
| Photovoltaic module qualification plus testing J Wohlgemuth, S Kurtz 2014 IEEE 40th Photovoltaic Specialist Conference (PVSC), 3589-3594, 2014 | 58 | 2014 |
| Evaluating and predicting molecular mechanisms of adhesive degradation during field and accelerated aging of photovoltaic modules J Tracy, DR D'hooge, N Bosco, C Delgado, R Dauskardt Progress in Photovoltaics: Research and Applications 26 (12), 981-993, 2018 | 52 | 2018 |
| Encapsulation and backsheet adhesion metrology for photovoltaic modules J Tracy, N Bosco, F Novoa, R Dauskardt Progress in Photovoltaics: Research and Applications 25 (1), 87-96, 2017 | 51 | 2017 |
| Reliability concerns associated with PV technologies N Bosco National Renewable Energy Laboratory, 2010 | 47 | 2010 |
| Encapsulant adhesion to surface metallization on photovoltaic cells J Tracy, N Bosco, R Dauskardt IEEE Journal of Photovoltaics 7 (6), 1635-1639, 2017 | 43 | 2017 |
| Determining outdoor CPV cell temperature M Muller, C Deline, B Marion, S Kurtz, N Bosco AIP conference proceedings 1407 (1), 331-335, 2011 | 42 | 2011 |
| The influence of PV module materials and design on solder joint thermal fatigue durability N Bosco, TJ Silverman, S Kurtz IEEE Journal of Photovoltaics 6 (6), 1407-1412, 2016 | 40 | 2016 |
| Defining threshold values of encapsulant and backsheet adhesion for PV module reliability N Bosco, J Eafanti, S Kurtz, J Tracy, R Dauskardt 2017 IEEE 44th Photovoltaic Specialist Conference (PVSC), 3190-3194, 2017 | 31 | 2017 |
| III-V/Si wafer bonding using transparent, conductive oxide interlayers AC Tamboli, MFAM van Hest, MA Steiner, S Essig, EE Perl, AG Norman, ... Applied Physics Letters 106 (26), 2015 | 27 | 2015 |
| Thermomechanical lift-off and recontacting of CdTe solar cells DL McGott, MD Kempe, S Glynn, N Bosco, TM Barnes, NM Haegel, ... ACS applied materials & interfaces 10 (51), 44854-44861, 2018 | 26 | 2018 |
| Development and first results of the width-tapered beam method for adhesion testing of photovoltaic material systems N Bosco, J Tracy, R Dauskardt, S Kurtz 2016 IEEE 43rd Photovoltaic Specialists Conference (PVSC), 0106-0110, 2016 | 25 | 2016 |
| Viscoelastic material characterization and modeling of photovoltaic module packaging materials for direct finite-element method input N Bosco, M Springer, X He IEEE Journal of Photovoltaics 10 (5), 1424-1440, 2020 | 23 | 2020 |
| Linear viscoelastic characterization of electrically conductive adhesives used as interconnect in photovoltaic modules M Springer, N Bosco Progress in Photovoltaics: Research and Applications 28 (7), 659-681, 2020 | 23 | 2020 |
