| Integrated circuit package with embedded bridge RV Mahajan, CJ Nelson, OG Karhade, F Eid, NA Deshpande, SM Liff US Patent 9,275,955, 2016 | 84 | 2016 |
| Reliable microstrip routing for electronics components OG Karhade, N Altunyurt, KO Lee, K Bharath US Patent 9,041,205, 2015 | 82 | 2015 |
| Underfill material flow control for reduced die-to-die spacing in semiconductor packages OG Karhade, NA Deshpande, RC Dias, E Cetegen, LD Skoglund US Patent 10,192,810, 2019 | 64 | 2019 |
| Integrated circuit package with embedded bridge RV Mahajan, CJ Nelson, OG Karhade, F Eid, NA Deshpande, SM Liff US Patent 10,068,852, 2018 | 52 | 2018 |
| Embedded multi-device bridge with through-bridge conductive via signal connection NA Deshpande, OG Karhade US Patent 9,754,890, 2017 | 43 | 2017 |
| Low cost package warpage solution OG Karhade, NA Deshpande, D Mallik, BM Ziadeh, Y Tomita US Patent 9,899,238, 2018 | 33 | 2018 |
| Die-to-die bonding and associated package configurations OG Karhade, D Mallik, RV Mahajan, AP Alur US Patent App. 14/198,509, 2015 | 20 | 2015 |
| Active control of grating interferometers for extended-range low-noise operation O Karhade, L Degertekin, T Kurfess Optics letters 34 (19), 3044-3046, 2009 | 19 | 2009 |
| Integrated circuit package with embedded bridge RV Mahajan, CJ Nelson, OG Karhade, F Eid, NA Deshpande, SM Liff US Patent 9,716,067, 2017 | 18 | 2017 |
| Methods for high precision microelectronic die integration A Aleksov, RV Mahajan, O Karhade, N Deshpande US Patent 9,076,882, 2015 | 18 | 2015 |
| On Package Floating Metal/Stiffener Grounding to Mitigate RFI and SI Risks H Jiang, R Starkston, DA Raorane, KD Jones, A Dhall, OG Karhade, ... US Patent App. 14/642,316, 2016 | 14 | 2016 |
| SOI-based micro scanning grating interferometers: device characterization, control and demonstration of parallel operation OG Karhade, FL Degertekin, TR Kurfess Journal of Micromechanics and Microengineering 18 (4), 045007, 2008 | 14 | 2008 |
| Methods to form high density through-mold interconnections OG Karhade, NA Deshpande, E Cetegen, EJ Li, D Mallik, BM Ziadeh US Patent 9,741,692, 2017 | 13 | 2017 |
| Novel cantilever for biosensing applications OG Karhade, SS Chiluveru, PR Apte 2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop …, 2004 | 11 | 2004 |
| Reliable microstrip routing for electronics components OG Karhade, N Altunyurt, KO Lee, K Bharath US Patent 9,607,947, 2017 | 10 | 2017 |
| Open cavity bridge co-planar placement architectures and processes O Karhade, D Raorane, S Agraharam, N Deshpande, M Modi, M Dubey, ... US Patent App. 16/828,405, 2021 | 8 | 2021 |
| Integrated circuit packages with plates OG Karhade, E Cetegen, SB Sane US Patent App. 16/349,959, 2019 | 7 | 2019 |
| High bandwidth, low profile multi-die package OG Karhade US Patent 10,109,616, 2018 | 7 | 2018 |
| Picture frame stiffeners for microelectronic packages Y Tomita, J Kubota, OG Karhade, SM Liff, K Ichikawa, NA Deshpande US Patent 9,502,368, 2016 | 7 | 2016 |
| High density interconnection of microelectronic devices OG Karhade, JS Guzek, JM Swan, CJ Nelson, NA Deshpande, ... US Patent 9,397,071, 2016 | 7 | 2016 |
F. Levent DegertekinProfessor, Georgia Institute of Technology, Atlanta, USA在 gatech.edu 的电子邮件经过验证
