| Low frequency acoustic energy harvesting using PZT piezoelectric plates in a straight tube resonator B Li, JH You, YJ Kim Smart Materials and Structures 22 (5), 055013, 2013 | 176 | 2013 |
| Harvesting low-frequency acoustic energy using quarter-wavelength straight-tube acoustic resonator B Li, AJ Laviage, JH You, YJ Kim Applied Acoustics 74 (11), 1271-1278, 2013 | 157 | 2013 |
| Acoustic energy harvesting using quarter-wavelength straight-tube resonator B Li, AJ Laviage, JH You, YJ Kim ASME International Mechanical Engineering Congress and Exposition 45288, 467-473, 2012 | 27 | 2012 |
| Size and constraint effects on interfacial fracture behavior of microscale solder interconnects B Li, XP Zhang, Y Yang, LM Yin, MG Pecht Microelectronics Reliability 53 (1), 154-163, 2013 | 26 | 2013 |
| Experimental study on self-powered synchronized switch harvesting on inductor circuits for multiple piezoelectric plates in acoustic energy harvesting B Li, JH You Journal of Intelligent Material Systems and Structures 26 (13), 1646-1655, 2015 | 22 | 2015 |
| Simulation of acoustic energy harvesting using piezoelectric plates in a quarter-wavelength straight-tube resonator B Li, JH You Proceedings of the 2012 COMSOL Conference in Boston, 2012 | 18 | 2012 |
| Harvesting ambient acoustic energy using acoustic resonators B Li, JH You Proceedings of Meetings on Acoustics 12 (1), 2011 | 15 | 2011 |
| Interaction effect between electromigration and microstructure evolution in BGA structure Cu/Sn-58Bi/Cu solder interconnects HB Qin, W Yue, CB Ke, MB Zhou, XP Zhang, B Li 2014 15th International Conference on Electronic Packaging Technology, 587-591, 2014 | 7 | 2014 |
| FE simulation of size effects on interface fracture characteristics of microscale lead-free solder interconnects B Li, L Yin, Y Yang, X Zhang 2009 International Conference on Electronic Packaging Technology & High …, 2009 | 7 | 2009 |
| Size effects on interface fracture behavior of lead-free micro-joints 黎滨， 杨艳， 尹立孟， 张新平 Journal of Mechanical Engineering 46 (18), 77-84, 2010 | 6* | 2010 |
| A Short Review of Piezoelectricity-based Vibration and Acoustic Energies Harvesting B Li Innovative Energy & Research 43 (3), 2015 | 3 | 2015 |
| Enhanced output power by eigenfrequency shift in acoustic energy harvester B Li, JH You Active and Passive Smart Structures and Integrated Systems 2014 9057, 757-764, 2014 | 3 | 2014 |
| Interaction effect between electromigration and microstructure evolution in Cu/Sn-58Bi/Cu solder interconnect HB Qin, B Li, W Yue, CB Ke, MB Zhou, XP Zhang 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2249-2254, 2014 | 2 | 2014 |
| Finite element simulation of fracture behavior of BGA structure solder interconnects Q Hong-Bo, L Bin, L Xun-Ping, Z Xin-Ping 2011 12th International Conference on Electronic Packaging Technology and …, 2011 | 2 | 2011 |
| Self-Powered Interface External Circuit for Low-Frequency Acoustic Energy Harvester B Li, JH You, YJ Kim ASME International Mechanical Engineering Congress and Exposition 56284 …, 2013 | 1 | 2013 |
| Comparison study of standard, conventional SSHI and self-powered SSHI interface circuits in piezoelectric energy conversion B Li, JH You power 14, 16, 2013 | 1 | 2013 |
| 无铅微互连焊点界面断裂行为及其电迁移和热时效影响的有限元模拟 黎滨 广州: 华南理工大学, 2009 | 1 | 2009 |
| Understanding Thermal Stability of Tin-Base Solders and Its Effect on Reliability of Downhole Electronics Y Wang, B Li, Y Xi, Y Wang, C Anude, J Stevens The Minerals, Metals & Materials Society (TMS) 2015, 2015 | | 2015 |
| Low frequency acoustic energy harvesting B Li Southern Methodist University, 2014 | | 2014 |
| Finite element simulation of interfacial fracture and impact behavior at the interfaces of microscale Sn-Ag-Cu solder interconnects HB Qin, B Li, XP Zhang 2010 11th International Conference on Electronic Packaging Technology & High …, 2010 | | 2010 |
