关注
Norazeani Abdul  Rahman
Norazeani Abdul Rahman
在 unimap.edu.my 的电子邮件经过验证
标题
引用次数
引用次数
年份
Performance analysis of two-dimensional systolic array matrix multiplication with orthogonal interconnections
AHM Shapri, NAZ Rahman
International Journal on New Computer Architectures and Their Applications 1 (3), 2001
292001
Monitoring system for uninterruptible power supply
SAZ Murad, MNM Isa, NA Rahman
American Journal of Applied Sciences 4 (3), 181-183, 2007
122007
Shearing speed induced stress comparison on gold and copper ball interconnection
Z Sauli, V Retnasamy, NA Rahman, WMW Norhaimi, N Ramli, R Vairavan
2012 Fourth International Conference on Computational Intelligence …, 2012
102012
Polymer core BGA stress analysis at minimal vertical loading
Z Sauli, V Retnasamy, S Taniselass, NAZ Rahman, MHA Aziz
Advanced Materials Research 622, 639-642, 2013
82013
FAB stress analysis comparison between au and al on paladium bond pad
V Retnasamy, Z Sauli, S Haimi, NA Rahman
Australian Journal of Basic and Applied Sciences 6 (9), 229-235, 2012
72012
Enhancing fractal image compression speed using peer adjacent mapping with sum of absolute difference for computed radiography images
NAZ Rahman, RC Ismail, AHM Shapri, MN Isa
AIP Conference Proceedings 2203 (1), 2020
62020
Gold ball shear stress analysis on different surface morphology
V Retnasamy, Z Sauli, NA Rahman, RM Hatta, R Vairavan, ...
2012 Fourth International Conference on Computational Intelligence …, 2012
62012
Peer adjacent mapping with optimum parameters for fractal image compression on medical images
NAZ Rahman, RC Ismail, AHM Shapri, MN Isa
AIP Conference Proceedings 2203 (1), 2020
22020
The role of Reactive Ion Etching (RIE) on wirebond formation: A study on successful rate of thermosonic gold wire on aluminium bondpad
Z Sauli, V Retnasamy, NAZ Rahman, MHA Aziz, HA Razak, ...
2012 10th IEEE International Conference on Semiconductor Electronics (ICSE …, 2012
22012
Effect of copper FAB impact on palladium bond pad
Z Sauli, V Retnasamy, S Taniselass, WMW Norhaimi, MHA Aziz, ...
2012 10th IEEE International Conference on Semiconductor Electronics (ICSE …, 2012
22012
Performance Study of Two-Dimensional Orthogonal Systolic Array
AH Mohd Shapri, NA Rahman, MH Abd. Wahid
Software Engineering and Computer Systems: Second International Conference …, 2011
22011
Shear ram speed characterization for copper wire bond shear test
Z Sauli, V Retnasamy, AHM Shapri, NAZ Rahman, WMW Norhaimi, ...
Applied Mechanics and Materials 229, 670-673, 2012
12012
2D velocity streamline visualization of microfluid flow in backward facing step microchannel
Z Sauli, S Taniselass, W Lim, NA Rahman, WMW Norhaimi, V Retnasamy
2012 Fourth International Conference on Computational Intelligence …, 2012
12012
Silica Microchannel Fabrication Using Fluorine Based Rie With Alas A Mask
W Haimi, V Retnasamy, Z Sauli, S Taniselass, AHM Shapri, NA Rahman, ...
Australian Journal of Basic and Applied Sciences 6 (9), 732-737, 2012
12012
Optimization and analysis of FPGA-based systolic array for matrix multiplication
AHM Shapri, NA Rahman, SMMS Zakaria, KK Chieh, S Saat
AIP Conference Proceedings 2898 (1), 2024
2024
Internet of Things (IoT) Based Projects: Designs and Implementations
SAZ Murad, NA Rahman, A Azizan
Penerbit Universiti Malaysia Perlis, 2022
2022
An Improved Irreversible Fractal Scheme for Medical Image Compression
NAZ Rahman, RC Ismail, AHM Shapri
IOP Conference Series: Materials Science and Engineering 932 (1), 012069, 2020
2020
Shear Ram Height Characterization for Copper Wire Bond Shear Test
Z Sauli, V Retnasamy, AHM Shapri, NAZ Rahman, WMW Norhaimi, ...
Applied Mechanics and Materials 229, 674-677, 2012
2012
Stress analysis on centric through hole PCB
Z Sauli, V Retnasamy, NAZ Rahman, B Man, NS Nadzri, R Vairavan
2012 10th IEEE International Conference on Semiconductor Electronics (ICSE …, 2012
2012
Shear ram speed characterization for copper wire bond shear test
S Zaliman, V Retnasamy, MS Ahmad Husni, AR Norazeani, ...
Trans Tech Publications, Switzerland., 2012
2012
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