| Additively manufactured nanotechnology and origami-enabled flexible microwave electronics JG Hester, S Kim, J Bito, T Le, J Kimionis, D Revier, C Saintsing, W Su, ... Proceedings of the IEEE 103 (4), 583-606, 2015 | 107 | 2015 |
| Inkjet-printed, vertically-integrated, high-performance inductors and transformers on flexible LCP substrate BS Cook, C Mariotti, JR Cooper, D Revier, BK Tehrani, L Aluigi, L Roselli, ... 2014 IEEE MTT-S International Microwave Symposium (IMS2014), 1-4, 2014 | 65 | 2014 |
| Lens cleaning via electrowetting DL Revier, BS Cook, DP Magee, SJ Fedigan US Patent 10,908,414, 2021 | 16 | 2021 |
| The principles of" smart" encapsulation: using additive printing technology for the realization of intelligent application-specific packages for IoT, 5G, and automotive radar … B Tehrani, R Bahr, D Revier, B Cook, M Tentzeris 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 111-117, 2018 | 16 | 2018 |
| Integrated circuit with dielectric waveguide connector using photonic bandgap structure BS Cook, DL Revier US Patent 10,371,891, 2019 | 14 | 2019 |
| Methods and apparatus for electrostatic control of expelled material for lens cleaners BS Cook, DL Revier, SJ Fedigan, DP Magee US Patent 11,607,704, 2023 | 11 | 2023 |
| Methods and apparatus for surface wetting control DL Revier, BS Cook, DP Magee, SJ Fedigan US Patent 10,780,467, 2020 | 11 | 2020 |
| Acoustic management in integrated circuit using phononic bandgap structure DL Revier, BS Cook US Patent 10,833,648, 2020 | 8 | 2020 |
| Electromagnetic interference shield within integrated circuit encapsulation using photonic bandgap structure BS Cook, DL Revier US Patent 10,497,651, 2019 | 8 | 2019 |
| Galvanic signal path isolation in an encapsulated package using a photonic structure BS Cook, DL Revier US Patent 10,444,432, 2019 | 8 | 2019 |
| Spectrometry in integrated circuit using a photonic bandgap structure BS Cook, DL Revier US Patent 10,557,754, 2020 | 7 | 2020 |
| Expanding the design space for electrically-driven soft robots through handed shearing auxetics I Good, T Brown-Moore, A Patil, D Revier, JI Lipton 2022 International Conference on Robotics and Automation (ICRA), 10951-10957, 2022 | 5 | 2022 |
| Kinematic modeling of handed shearing auxetics via piecewise constant curvature A Garg, I Good, D Revier, K Airis, J Lipton 2022 IEEE 5th International Conference on Soft Robotics (RoboSoft), 423-430, 2022 | 5 | 2022 |
| Thermal management in integrated circuit using phononic bandgap structure BS Cook, DL Revier US Patent 10,886,187, 2021 | 5 | 2021 |
| Applied viscous thread instability for manufacturing 3D printed foams B Emery, D Revier Proceedings of the 7th Annual ACM Symposium on Computational Fabrication, 1-2, 2022 | 4 | 2022 |
| Nanoparticle backside die adhesion layer BS Cook, DL Revier, S Naseem, MH Chowdhury US Patent 11,031,364, 2021 | 3 | 2021 |
| 3D printed semiconductor package BS Cook, DL Revier US Patent 10,910,465, 2021 | 3 | 2021 |
| Semiconductor package with liquid metal conductors DP Parekh, BS Cook, DL Revier, J Bito US Patent 10,879,151, 2020 | 3 | 2020 |
| A low-cost, single platform, hybrid manufacturing system for RF passives DL Revier, MM Tentzeris 2017 IEEE Radio and Wireless Symposium (RWS), 83-85, 2017 | 3 | 2017 |
| Beam former development for the NASA Hurricane Imaging Radiometer GD Hopkins, JR Skala, DL Revier, MW James, DE Simmons, CS Ruf, ... 2015 IEEE Aerospace Conference, 1-15, 2015 | 3 | 2015 |
Benjamin S. CookR&D Director, Meta Reality Labs在 ti.com 的电子邮件经过验证
