| Syntheses of porous self‐supporting metal‐nanoparticle assemblies with 3D morphologies inherited from biosilica templates (diatom frustules) Z Bao, EM Ernst, S Yoo, KH Sandhage Advanced materials 21 (4), 474-478, 2009 | 136 | 2009 |
| TiO2–SnO2 nanostructures and their H2 sensing behavior CM Carney, S Yoo, SA Akbar Sensors and Actuators B: Chemical 108 (1-2), 29-33, 2005 | 134 | 2005 |
| Nanocarving of bulk titania crystals into oriented arrays of single‐crystal nanofibers via reaction with hydrogen‐bearing gas S Yoo, SA Akbar, KH Sandhage Advanced materials 16 (3), 260-264, 2004 | 101 | 2004 |
| Effect of Si content on surface hardening of Al–Si alloy by shot peening treatment KT Cho, S Yoo, KM Lim, HS Kim, WB Lee Journal of Alloys and Compounds 509, S265-S270, 2011 | 52 | 2011 |
| Interfacial reactions and mechanical strength of Sn-3.0 Ag-0.5 Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications BS Lee, YH Ko, JH Bang, CW Lee, S Yoo, JK Kim, JW Yoon Microelectronics Reliability 71, 119-125, 2017 | 50 | 2017 |
| Nanocarving of titania (TiO2): a novel approach for fabricating chemical sensing platform S Yoo, SA Akbar, KH Sandhage Ceramics International 30 (7), 1121-1126, 2004 | 49 | 2004 |
| Power module packaging technology with extended reliability for electric vehicle applications JW Yoon, JH Bang, YH Ko, SH Yoo, JK Kim, CW Lee Journal of the Microelectronics and Packaging Society 21 (4), 1-13, 2014 | 43 | 2014 |
| High-speed TSV filling with molten solder YK Ko, HT Fujii, YS Sato, CW Lee, S Yoo Microelectronic Engineering 89, 62-64, 2012 | 43 | 2012 |
| Effects of surface finishes and loading speeds on shear strength of Sn–3.0 Ag–0.5 Cu solder joints JM Kim, MH Jeong, S Yoo, CW Lee, YB Park Microelectronic Engineering 89, 55-57, 2012 | 39 | 2012 |
| Evaluation on reliability of high temperature lead-free solder for automotive electronics YH Ko, SH Yoo, CW Lee Journal of the Microelectronics and Packaging Society 17 (4), 35-40, 2010 | 36 | 2010 |
| Effect of PCB surface finishs on intermetallic compound growth kinetics of Sn-3.0 Ag-0.5 Cu solder bump MH Jeong, JM Kim, SH Yoo, CW Lee, YB Park Journal of the Microelectronics and Packaging Society 17 (1), 81-88, 2010 | 31 | 2010 |
| High refractive index and transparent nanocomposites as encapsulant for high brightness LED packaging Y Liu, Z Lin, X Zhao, CC Tuan, KS Moon, S Yoo, MG Jang, C Wong IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (7 …, 2014 | 30 | 2014 |
| The effect of intermetallic compound evolution on the fracture behavior of Au stud bumps joined with Sn-3.5 Ag solder YK Lee, YH Ko, JK Kim, CW Lee, S Yoo Electronic Materials Letters 9, 31-39, 2013 | 25 | 2013 |
| Variation of thermal resistance of LED module embedded by thermal via HW Shin, HS Lee, JO Bang, SH Yoo, SB Jung, KD Kim Journal of the Microelectronics and Packaging Society 17 (4), 95-100, 2010 | 21 | 2010 |
| Effects of surface finishes and current stressing on interfacial reaction characteristics of Sn-3.0 Ag-0.5 Cu solder bumps JM Kim, MH Jeong, S Yoo, YB Park Journal of electronic materials 41, 791-799, 2012 | 20 | 2012 |
| Effect of Cu electroplating parameters on microvoid formation and high-speed shear strength in Sn-3.0 Ag-0.5 Cu/Cu joints JY Park, W Seo, S Yoo, YH Kim Journal of Alloys and Compounds 724, 492-500, 2017 | 19 | 2017 |
| Solderability of thin ENEPIG plating Layer for Fine Pitch Package application JH Back, BS Lee, S Yoo, DG Han, SB Jung, JW Yoon Journal of the Microelectronics and Packaging Society 24 (1), 83-90, 2017 | 18 | 2017 |
| Joint properties of solder capped copper pillars for 3D packaging YK Sa, S Yoo, YS Shin, MK Han, CW Lee 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 17 | 2010 |
| Interfacial reactions of fine-pitch Cu/Sn–3.5 Ag pillar joints on Cu/Zn and Cu/Ni under bump metallurgies MS Kim, MS Kang, JH Bang, CW Lee, MS Kim, S Yoo Journal of alloys and compounds 616, 394-400, 2014 | 16 | 2014 |
| Kinetic mechanism of TiO2 nanocarving via reaction with hydrogen gas S Yoo, SA Dregia, SA Akbar, H Rick, KH Sandhage Journal of materials research 21 (7), 1822-1829, 2006 | 16 | 2006 |
