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| Method and composition for polishing a substrate FQ Liu, SD Tsai, Y Hu, SS Neo, Y Wang, A Duboust, LY Chen US Patent 7,232,514, 2007 | 68 | 2007 |
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| Method and apparatus for electrochemical-mechanical planarization L Sun, SD Tsai, FC Redeker US Patent 6,739,951, 2004 | 64 | 2004 |
| Method and composition for polishing a substrate FQ Liu, T Du, A Duboust, Y Wang, Y Hu, SD Tsai, LY Chen, WC Tu, ... US Patent 7,323,416, 2008 | 61 | 2008 |
| Method and composition for fine copper slurry for low dishing in ECMP F Liu, S Tsai, Y Hu, LY Chen US Patent App. 10/845,754, 2004 | 61 | 2004 |
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| Endpoint monitoring with polishing rate change S Tsai, FC Redeker, K Wijekoon US Patent 6,309,276, 2001 | 58 | 2001 |
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| Method and composition for polishing a substrate FQ Liu, LY Chen, SD Tsai, A Duboust, SS Neo, Y Hu, Y Wang, ... US Patent 7,160,432, 2007 | 51 | 2007 |
