| Microstructured magnetic tunnel junctions WJ Gallagher, SSP Parkin, Y Lu, XP Bian, A Marley, KP Roche, ... Journal of Applied Physics 81 (8), 3741-3746, 1997 | 583 | 1997 |
| Hydrogenated oxidized silicon carbon material A Grill, CV Jahnes, VV Patel, LC Perraud US Patent 6,147,009, 2000 | 506 | 2000 |
| Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same LP Buchwalter, AC Callegari, SA Cohen, TO Graham, JP Hummel, ... US Patent 6,184,121, 2001 | 290 | 2001 |
| Production of electroless Co (P) with designed coercivity M Paunovic, C Jahnes US Patent 6,197,364, 2001 | 274 | 2001 |
| Dual damascene processing for semiconductor chip interconnects A Grill, JP Hummel, CV Jahnes, VV Patel, KL Saenger US Patent 6,140,226, 2000 | 258 | 2000 |
| Non-blocking 4x4 electro-optic silicon switch for on-chip photonic networks M Yang, WMJ Green, S Assefa, J Van Campenhout, BG Lee, CV Jahnes, ... Optics express 19 (1), 47-54, 2011 | 228 | 2011 |
| Integrated circuit inductor JN Burghartz, DC Edelstein, CV Jahnes, CE Uzoh US Patent 5,884,990, 1999 | 217 | 1999 |
| Integrated circuit toroidal inductor JN Burghartz, DC Edelstein, CV Jahnes, CE Uzoh US Patent 5,793,272, 1998 | 201 | 1998 |
| Low temperature Bi-CMOS compatible process for MEMS RF resonators and filters LP Buchwalter, KK Chan, TJ Dalton, CV Jahnes, JL Lund, KS Petrarca, ... US Patent 7,943,412, 2011 | 180 | 2011 |
| On the pitting resistance of sputter‐deposited aluminum alloys GS Frankel, RC Newman, CV Jahnes, MA Russak Journal of the Electrochemical Society 140 (8), 2192, 1993 | 178 | 1993 |
| Integrated circuit spiral inductor JN Burghartz, DC Edelstein, CV Jahnes, CE Uzoh US Patent 6,114,937, 2000 | 171 | 2000 |
| The respective role of oxygen and water vapor on the tribology of hydrogenated diamond-like carbon coatings C Donnet, TL Mogne, L Ponsonnet, M Belin, A Grill, V Patel, C Jahnes Tribology Letters 4 (3), 259-265, 1998 | 169 | 1998 |
| Multilayer interconnect structure containing air gaps and method for making KE Babich, RA Carruthers, TJ Dalton, A Grill, JC Hedrick, CV Jahnes, ... US Patent 6,815,329, 2004 | 166 | 2004 |
| Method of forming multilevel interconnect structure containing air gaps including utilizing both sacrificial and placeholder material A Grill, JC Hedrick, CV Jahnes, SV Nitta, KS Petrarca, S Purushothaman, ... US Patent 6,413,852, 2002 | 164 | 2002 |
| Methods for fabricating contacts to pillar structures in integrated circuits S Assefa, G Costrini, CV Jahnes, MJ Rooks, JZ Sun US Patent 8,008,095, 2011 | 138 | 2011 |
| 2.5 D and 3D technology challenges and test vehicle demonstrations JU Knickerbocker, PS Andry, E Colgan, B Dang, T Dickson, X Gu, ... 2012 IEEE 62nd Electronic Components and Technology Conference, 1068-1076, 2012 | 121 | 2012 |
| Multilevel interconnect structure containing air gaps and method for making A Grill, JC Hedrick, CV Jahnes, SV Nitta, KS Petrarca, S Purushothaman, ... US Patent 6,737,725, 2004 | 119 | 2004 |
| Pitting of sputtered aluminum alloy thin films GS Frankel, MA Russak, CV Jahnes, M Mirzamaani, VA Brusic | 118 | 1989 |
| Apparatus and methods for encapsulating microelectromechanical (MEM) devices on a wafer scale EG Colgan, BK Furman, CV Jahnes US Patent 7,344,907, 2008 | 117 | 2008 |
| Terabit/sec VCSEL-based 48-channel optical module based on holey CMOS transceiver IC FE Doany, BG Lee, DM Kuchta, AV Rylyakov, C Baks, C Jahnes, F Libsch, ... Journal of lightwave technology 31 (4), 672-680, 2013 | 112 | 2013 |
