受强制性开放获取政策约束的文章 - jay im了解详情
无法在其他位置公开访问的文章：2 篇
Effect of scaling copper through-silicon vias on stress and reliability for 3D interconnects
L Spinella, M Park, J Im, P Ho, N Tamura, T Jiang
IEEE International Interconnect Technology Conference / Advanced …, 2016
强制性开放获取政策： US Department of Energy
Investigation of thermo-mechanical stresses and reliability of 3D die-stack structures by synchrotron x-ray micro-diffraction
T Jiang, P Su, P Kim, C Bassett, K Sichak, J Gandhi, J Li, J Im, R Huang, ...
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1718-1724, 2015
强制性开放获取政策： US Department of Energy
可在其他位置公开访问的文章：1 篇
Synchrotron X-Ray Microdiffraction Investigation of Scaling Effects on Reliability for Through-Silicon Vias for 3-D Integration
L Spinella, T Jiang, N Tamura, J Im, P Ho
IEEE Transactions on Device and Materials Reliability 19 (3), 568-571, 2019
强制性开放获取政策： US Department of Energy
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