| Laser sintering of copper nanoparticles on top of silicon substrates A Soltani, B Khorramdel, A Mardoukhi, M Mäntysalo Nanotechnology 27 (3), 035203, 2015 | 40 | 2015 |
| Inkjet printing technology for increasing the I/O density of 3D TSV interposers B Khorramdel, J Liljeholm, MM Laurila, T Lammi, G Mårtensson, T Ebefors, ... Microsystems & nanoengineering 3 (1), 1-9, 2017 | 36 | 2017 |
| Combination of E-jet and inkjet printing for additive fabrication of multilayer high-density RDL of silicon interposer MM Laurila, B Khorramdel, M Mäntysalo IEEE Transactions on Electron Devices 64 (3), 1217-1224, 2017 | 34 | 2017 |
| Electrical contacts in SOI MEMS using aerosol jet printing B Khorramdel, A Torkkeli, M Mäntysalo IEEE Journal of the Electron Devices Society 6, 34-40, 2017 | 26 | 2017 |
| Fabrication and electrical characterization of partially metallized vias fabricated by inkjet B Khorramdel, M Mäntysalo Journal of Micromechanics and Microengineering 26 (4), 045017, 2016 | 19 | 2016 |
| Inkjet filling of TSVs with silver nanoparticle ink B Khorramdel, M Mäntysalo Proceedings of the 5th Electronics System-Integration Technology Conference …, 2014 | 19 | 2014 |
| Failure mechanisms in flip‐chip bonding on stretchable printed electronics MH Behfar, B Khorramdel, A Korhonen, E Jansson, A Leinonen, ... Advanced Engineering Materials 23 (12), 2100264, 2021 | 16 | 2021 |
| Metallization of high density TSVs using super inkjet technology B Khorramdel, MM Laurila, M Mäntysalo 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 41-45, 2015 | 16 | 2015 |
| Statistical analysis of E-jet print parameter effects on Ag-nanoparticle ink droplet size MM Laurila, B Khorramdel, A Dastpak, M Mäntysalo Journal of Micromechanics and Microengineering 27 (9), 095005, 2017 | 14 | 2017 |
| Inkjet printed metallic micropillars for bare die flip-chip bonding B Khorramdel, TM Kraft, M Mäntysalo Flexible and Printed Electronics 2 (4), 045005, 2017 | 12 | 2017 |
| Fabrication and characterization of screen printed stretchable carbon interconnects M Mosallaei, B Khorramdel, M Honkanen, P Iso-Ketola, J Vanhala, ... 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 78-83, 2017 | 7 | 2017 |
| Mechanically driven strategies to improve electromechanical behaviour of printed stretchable electronic systems D Di Vito, M Mosallaei, B Khorramdel, M Kanerva, M Mäntysalo Scientific Reports 10 (1), 12037, 2020 | 6 | 2020 |
| Improvements in the electromechanical properties of stretchable interconnects by locally tuning the stiffness M Mosallaei, D Di Vito, B Khorramdel, M Mäntysalo Flexible and Printed Electronics 5 (1), 015004, 2020 | 5 | 2020 |
| Rolling reliability of polyurethane and polyurethane-acrylic ICAs interconnections on printed stretchable electronics Z Fu, V Panula, B Khorramdel, M Mäntysalo Microelectronics Reliability 119, 114067, 2021 | 3 | 2021 |
| Deformability Analysis and Improvement in Stretchable Electronics Systems Through Finite Element Analysis D Di Vito, M Mosallaei, B Khorramdel, M Kanerva, M Mäntysalo Conference of the Italian Association of Theoretical and Applied Mechanics …, 2019 | 3 | 2019 |
| High-Resolution E-Jet Enhanced MEMS Packaging MM Laurila, B Khorramdel, M Mäntysalo Electrochemical Society Meeting Abstracts 4dms18, 128-128, 2018 | | 2018 |
| Additive and Digital Fabrication of 3D Interconnects in MEMS Packaging Using Printing Technologies B Khorramdel | | 2018 |
| Influence of suspension characteristics on thermally sprayed aluminum oxide coatings B Khorramdel Tampere University of Technology, 2013 | | 2013 |
| Study of properties and applications of shape memory alloys (Nickel based) B Khorramdel Karaj Azad University, 2006 | | 2006 |
Matti MantysaloTampere University在 tuni.fi 的电子邮件经过验证
