| Periodically twinned SiC nanowires DH Wang, D Xu, Q Wang, YJ Hao, GQ Jin, XY Guo, KN Tu Nanotechnology 19 (21), 215602, 2008 | 183 | 2008 |
| Highly spectral dependent enhancement of upconversion emission with sputtered gold island films H Zhang, D Xu, Y Huang, X Duan Chemical Communications 47 (3), 979-981, 2011 | 127 | 2011 |
| Nanotwin formation in copper thin films by stress/strain relaxation in pulse electrodeposition D Xu, WL Kwan, K Chen, X Zhang, V Ozoliņš, KN Tu Applied Physics Letters 91 (25), 2007 | 116 | 2007 |
| In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper D Xu, V Sriram, V Ozolins, JM Yang, KN Tu, GR Stafford, C Beauchamp Journal of Applied Physics 105 (2), 2009 | 94 | 2009 |
| Growth of nickel silicides in Si and Si/SiOx core/shell nanowires YC Lin, Y Chen, D Xu, Y Huang Nano letters 10 (11), 4721-4726, 2010 | 92 | 2010 |
| Structure and migration of (112) step on (111) twin boundaries in nanocrystalline copper L Xu, D Xu, KN Tu, Y Cai, N Wang, P Dixit, JHL Pang, J Miao Journal of Applied Physics 104 (11), 2008 | 70 | 2008 |
| Nanotwin formation and its physical properties and effect on reliability of copper interconnects D Xu, V Sriram, V Ozolins, JM Yang, KN Tu, GR Stafford, C Beauchamp, ... Microelectronic Engineering 85 (10), 2155-2158, 2008 | 45 | 2008 |
| Modulation of crystallographic texture and twinning structure of Cu nanowires by electrodeposition CN Liao, YC Lu, D Xu Journal of the Electrochemical Society 160 (6), D207, 2013 | 29 | 2013 |
| Electromigration failure with thermal gradient effect in SnAgCu solder joints with various UBM L Xu, SW Liang, D Xu, JK Han, J Liang, KN Tu 2009 59th Electronic Components and Technology Conference, 909-913, 2009 | 19 | 2009 |
| Erratum:“Nanotwin formation in copper thin films by stress/strain relaxation in pulse electrodeposition”[Appl. Phys. Lett. 91, 254105 (2007)] D Xu, WL Kwan, K Chen, X Zhang, V Ozolins, KN Tu Applied Physics Letters 97 (12), 2010 | 4 | 2010 |
| Improved Interconnect Properties For Nano‐Twinned Copper: Microstructure And Stability D Xu, HP Chen, KN Tu AIP Conference Proceedings 1300 (1), 23-32, 2010 | 3 | 2010 |
| Nanotwin-modified copper interconnects and its effect on the physical properties of copper D Xu, L Xu, V Sriram, K Sun, JM Yang, KN Tu 2009 59th Electronic Components and Technology Conference, 2060-2063, 2009 | 1 | 2009 |
| Nanotwin formation by electrodeposition and its influence on the physical properties and reliability of copper interconnects D Xu University of California, Los Angeles, 2009 | 1 | 2009 |
| Thermo-electromigration induced failure in WL-CSP Pb-free solder joints L Xu, SW Liang, D Xu, KN Tu, S Gee, L Nguyen, M Andrews International Conference and Exhibition on Device Packaging 2009, 2776-2811, 2008 | 1 | 2008 |
| Magnetoresistance flipping of Fe∕ Ru multilayers prepared by electron-beam evaporation KW Geng, Y Gu, D Xu, C Song, F Pan Journal of applied physics 98 (7), 2005 | | 2005 |
