| Study on an optimized configuration of conformal cooling channel by branching law JH Choi, JS Kim, ES Han, HP Park, BO Rhee Engineering Systems Design and Analysis 45837, V001T06A007, 2014 | 22 | 2014 |
| A Study on the Void Formation in Residual Wall Thickness of Fluid‐assisted Injection Molding Parts HP Park, BS Cha, SB Park, JH Choi, DH Kim, BO Rhee, KH Lee Advances in Materials Science and Engineering 2014 (1), 238251, 2014 | 22 | 2014 |
| New dummy design and stiffener on warpage reduction in Ball Grid Array Printed Circuit Board S Cho, TE Chang, JY Lee, HP Park, Y Ko, GM Park Microelectronics Reliability 50 (2), 242-250, 2010 | 21 | 2010 |
| A study on the estimation of plastic deformation of metal insert parts in multi-cavity injection molding by injection-structural coupled analysis H Park, B Cha, S Cho, D Kim, JH Choi, BG Pyo, B Rhee The International Journal of Advanced Manufacturing Technology 83, 2057-2069, 2016 | 18 | 2016 |
| Effects of the viscosity and thermal property of fluids on the residual wall thickness and concentricity of the hollow products in fluid-assisted injection molding H Park, B Rhee The International Journal of Advanced Manufacturing Technology 86, 3255-3265, 2016 | 12 | 2016 |
| A Study of electro-magnetic shield effectiveness for Automotive High Voltage Connector HL Kim, JW Choi, SW Kim, NJ Kang, KS Choi, HP Park, BS Cha Proceedings of the Korean Society of Precision Engineering Conference, 1263-1264, 2010 | 11 | 2010 |
| An optimal cure process to minimize residual void and optical birefringence for a LED silicone encapsulant MJ Song, KH Kim, GS Yoon, HP Park, HK Kim Materials 7 (6), 4088-4104, 2014 | 10 | 2014 |
| Method for manufacturing dental scaler tip using powder injection molding process, mold used therein and scaler tip manufactured by the same CJ Hwang, HP Park, YB Ko, YM Heo, JS Kim US Patent 7,875,237, 2011 | 10 | 2011 |
| Computer aided engineering design of powder injection molding process for a dental scaler tip mold design CJ Hwang, YB Ko, HP Park, ST Chung, BO Rhee Materials science forum 534, 341-344, 2007 | 9 | 2007 |
| CAE Analysis of Powder Injection Molding Process for Dental Scaler Mold YB Ko, HP Park, ST Chung, BO Rhee, CJ Hwang Transactions of Materials Processing 14 (6), 570-576, 2005 | 9 | 2005 |
| Development of metal plate with internal structure utilizing the metal injection molding (MIM) process K Shin, Y Heo, H Park, S Chang, B Rhee Materials 6 (12), 5878-5892, 2013 | 8 | 2013 |
| Variable-runner system for family mold filling balance HP Park, BO Rhee, BS Cha Solid State Phenomena 116, 96-101, 2006 | 8 | 2006 |
| Experimental and Numerical Investigation of the Effect of Process Conditions on Residual Wall Thickness and Cooling and Surface Characteristics of Water‐Assisted Injection … H Park, BS Cha, B Rhee Advances in Materials Science and Engineering 2015 (1), 161938, 2015 | 7 | 2015 |
| An Experimental Study for the Filling Balance of the Family Mold HP Park, BS Cha, BO Rhee Transactions of Materials Processing 15 (1), 47-56, 2006 | 7 | 2006 |
| Analysis of the three dimensional mold-filling process in injection molding K Choi, BH Koo ANTEC-CONFERENCE PROCEEDINGS-. 1, 501-505, 2004 | 7 | 2004 |
| Effects of Variation in Process Parameters on Cavity Pressure and Mechanical Strength of Molded Parts in LSR Injection Molding HP Park, BS Cha, JW Lee, YB Ko, SG Kim, TS Jung, DH Kim, BO Rhee Journal of the Korean Society of Manufacturing Technology Engineers 23 (2 …, 2014 | 6 | 2014 |
| Development of Rapid Mold Heating HP Park, BS Cha, BO Rhee Cooling Technology to Improve the Surface Defects of Injection Molded Parts …, 2009 | 6 | 2009 |
| An experimental study of the variable-runner system BO Rhee, HP Park, K Lee SPE ANTEC Conf, 1113-1117, 2006 | 6 | 2006 |
| A study on the reliability of micro-vias in printed circuit boards during thermal cycling Y Ko, H Park, G Park, S Cho Advanced Science Letters 19 (12), 3683-3687, 2013 | 5 | 2013 |
| Evaluation of heat transfer conditions to the mold temperature stabilization in the injection molding process J Tae, J Kim, J Gim, H Park, B Rhee Proc. ANTEC2013, Cincinnati, USA, 2013 | 5 | 2013 |
