| Effect on plasma and etch-rate uniformity of controlled phase shift between rf voltages applied to powered electrodes in a triode capacitively coupled plasma reactor D Sung, S Jeong, Y Park, VN Volynets, AG Ushakov, GH Kim Journal of Vacuum Science & Technology A 27 (1), 13-19, 2009 | 33 | 2009 |
| Plasma generating apparatus SJ Jeon, Y Tolmachev, SH Lee, SH Seok, YM Park, WH Jang US Patent 8,169,148, 2012 | 22 | 2012 |
| Method of Forming an Epitaxial Layer and Apparatus for Processing a Substrate Used for the Method TK Hong, Y Park, HW Oh, J Choi, SC Han US Patent App. 14/520,768, 2015 | 3 | 2015 |
| Plasma Processing Apparatus JHL YM Park, YH Lim, JS Lee KR Patent 101208408B1, 2010 | | 2010 |
| Wafer Transferring apparatus and transferring method thereof HRP Youngmin Park, Dongchul Kim, DH Namgung, NJ Park KR Patent App. 100676823B1, 2005 | | 2005 |
| Device and method for chemical vapour deposition (CVD) YP Andrei CN Patent App. 200,510,075,315, 2005 | | 2005 |
| A study on the dynamic feedback linearization of the nonlinear systems Y Park Chung-Ang University, 2003 | | 2003 |
| Optimal Structure of Wavelet Neural Network Systems Using Wavelet Decomposition Algorithm 류동영， 박영민， 이홍기 한국지능시스템학회 학술발표 논문집 12 (2), 171-174, 2002 | | 2002 |
