| Surface roughness modeling of substrate integrated waveguide in D-band M Yi, S Li, H Yu, W Khan, C Ulusoy, A Vera-Lopez, J Papapolymerou, ... IEEE Transactions on Microwave Theory and Techniques 64 (4), 1209-1216, 2016 | 38 | 2016 |
| Investigation of surface roughness effects for D-band SIW transmission lines on LCP substrate S Li, M Yi, S Pavlidis, H Yu, M Swaminathan, J Papapolymerou 2017 IEEE Radio and Wireless Symposium (RWS), 121-124, 2017 | 17 | 2017 |
| Skin-effect-incorporated transient simulation using the Laguerre-FDTD scheme M Yi, M Ha, Z Qian, A Aydiner, M Swaminathan IEEE transactions on microwave theory and techniques 61 (12), 4029-4039, 2013 | 15 | 2013 |
| Transient simulation of multiscale structures using the nonconformal domain decomposition Laguerre-FDTD method M Yi, Z Qian, A Aydiner, M Swaminathan IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (4 …, 2015 | 13 | 2015 |
| Electrothermomechanical analysis of partially insulated field-effect transistors using hybrid nonlinear finite element method M Yi, WY Yin Microelectronics reliability 51 (5), 895-903, 2011 | 11 | 2011 |
| Skin effect modeling of interconnects using the Laguerre-FDTD scheme M Yi, M Swaminathan, Z Qian, A Aydiner 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging …, 2012 | 7 | 2012 |
| Memory efficient Laguerre-FDTD scheme for dispersive media M Yi, M Swaminathan, M Ha, Z Qian, A Aydiner 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging …, 2013 | 4 | 2013 |
| Transient non-conformal domain decomposition using the Laguerre-FDTD method M Yi, M Swaminathan 2015 IEEE International Conference on Computational Electromagnetics, 327-329, 2015 | 1 | 2015 |
| 2-D non-conformal domain decomposition using the Laguerre-FDTD scheme M Yi, M Swaminathan, Z Qian, A Aydiner 2014 IEEE Antennas and Propagation Society International Symposium (APSURSI …, 2014 | 1 | 2014 |
| Transient simulation for multiscale chip-package structures using the Laguerre-FDTD scheme M Yi Georgia Institute of Technology, 2015 | | 2015 |
| Transient simulation of interconnects in chip-package structure using the non-conformal domain decomposition scheme M Yi, M Swaminathan Semiconductor Research Corporation (SRC) TECHCON, 2014 | | 2014 |
| Concurrent analysis of self-heating effect and thermal stress in partially insulated field effect transistors (PiFETs) M Yi, WY Yin 2010 IEEE Electrical Design of Advanced Package & Systems Symposium, 1-4, 2010 | | 2010 |
Zhiguo QianIntel在 intel.com 的电子邮件经过验证
Zhiguo QianIntel在 intel.com 的电子邮件经过验证
A. C. UlusoyKarlsruhe Institute of Technology在 kit.edu 的电子邮件经过验证