Microstructural evolution and mechanical properties of high strength 3–9% Ni-steel alloys weld metals produced by electron beam welding KI S. Khodir, T. Shibayanagi, M. Takahashi, Hamed Abdel-Aleem Materials and Design 60, 391-400, 2014 | 57 | 2014 |
Evaluation by ultrasonic testing and TEM observation of bond interface for ultrasonic bonds of 5052/SUS304 and 5052/SPCC H Abdel-Aleem, M Katoh, K Nishio, T Yamaguchi, Y Tsue Quarterly Journal of the Japan Welding Society 23 (2), 194-202, 2005 | 8 | 2005 |
Joining of A1050/A5052 and A1050/Cu by ultrasonic bonding and their materials evaluation AA Hamed, T YAMAGATA, M KATOH, K NISHIO, T YAMAGUCHI 溶接学会論文集 21 (4), 493-500, 2003 | 5 | 2003 |
Joining of 1050/5052 by resistance seam welding and materials evaluation of joints H Abdel-Aleem, M Kato, K Nishio, T Yamaguchi, K Furukawa Welding international 19 (3), 199-204, 2005 | 3 | 2005 |
Joining of A1050/A5052 and A1050/Cu by Ultrasonic Bonding and their Materials Evaluation H Abdel-Aleem, T Yamagata, M Katoh, K NISHIO, T YAMAGUCHI Quarterly Journal of the Japan Welding Society 21 (4), 493-500, 2003 | 3 | 2003 |
Role of Welding Defects on the Failure of Sub-sea Carbon Steel Gas Pipeline HAA S. Khodir International Journal of Engineering and Technical Research 3 (5), 395-398, 2015 | | 2015 |
Joining of 5052/SPCC and 5052/SUS304 by Ultrasonic Bonding and their Materials Evaluation H Abdel-Aleem, M Katoh, K Nishio, T Yamaguchi, Y Tsue 溶接学会全国大会講演概要, 142-143, 2004 | | 2004 |
Joining of A1050/A5052 and A1050/Cu by ultrasonic bonding and their materials evaluation H Abdel-Aleem, T Yamagata, M Katoh, K Nishio, T Yamaguchi WELDING RESEARCH ABROAD 50 (8/9), 17-24, 2004 | | 2004 |
Influence of Oxide Film on the Bondability of Aluminum in Ultrasonic Bonding AA Hamed, K Mitsuaki, N Kazumasa, Y Tomiko, Y Yoshihiko 溶接学会全国大会講演概要 73, 284-285, 2003 | | 2003 |
342 Joining of A1050/A5052 by Resistance Seam Welding and its Materials Evaluation AA Hamed, M Katoh, K Nishio, T Yamaguchi, K Furukawa 溶接学会全国大会講演概要, 298-299, 2002 | | 2002 |
341 Joining of A1050/A5052 and A1050/Cu by Ultrasonic Bonding and thier Materials Evaluation AA Hamed, M Katoh, K Nishio, T Yamaguchi, T Yamagata 溶接学会全国大会講演概要, 296-297, 2002 | | 2002 |