Electrodeposited Ni dendrites with high activity and durability for hydrogen evolution reaction in alkaline water electrolysis SH Ahn, SJ Hwang, SJ Yoo, I Choi, HJ Kim, JH Jang, SW Nam, TH Lim, ... Journal of Materials Chemistry 22 (30), 15153-15159, 2012 | 193 | 2012 |
Fabrication and characterization of a PDMS–glass hybrid continuous-flow PCR chip JA Kim, JY Lee, S Seong, SH Cha, SH Lee, JJ Kim, TH Park Biochemical Engineering Journal 29 (1-2), 91-97, 2006 | 168 | 2006 |
Electrochemical CO2 reduction to CO on dendritic Ag–Cu electrocatalysts prepared by electrodeposition J Choi, MJ Kim, SH Ahn, I Choi, JH Jang, YS Ham, JJ Kim, SK Kim Chemical Engineering Journal 299, 37-44, 2016 | 165 | 2016 |
Enhanced catalytic activity of electrodeposited Ni-Cu-P toward oxygen evolution reaction BK Kim, SK Kim, SK Cho, JJ Kim Applied Catalysis B: Environmental 237, 409-415, 2018 | 126 | 2018 |
Fading mechanisms of carbon-coated and disproportionated Si/SiOx negative electrode (Si/SiOx/C) in Li-ion secondary batteries: Dynamics and component analysis by TEM I Choi, MJ Lee, SM Oh, JJ Kim Electrochimica Acta 85, 369-376, 2012 | 124 | 2012 |
Catalytic behavior of 3-mercapto-1-propane sulfonic acid on Cu electrodeposition and its effect on Cu film properties for CMOS device metallization JJ Kim, SK Kim, YS Kim Journal of electroanalytical chemistry 542, 61-66, 2003 | 121 | 2003 |
Superfilling evolution in Cu electrodeposition: dependence on the aging time of the accelerator SK Kim, JJ Kim Electrochemical and solid-state letters 7 (9), C98, 2004 | 104 | 2004 |
Bottom-up filling in Cu electroless deposition using bis-(3-sulfopropyl)-disulfide (SPS) CH Lee, SC Lee, JJ Kim Electrochimica acta 50 (16-17), 3563-3568, 2005 | 85 | 2005 |
The influence of thiourea on copper electrodeposition: Adsorbate identification and effect on electrochemical nucleation MS Kang, SK Kim, K Kim, JJ Kim Thin Solid Films 516 (12), 3761-3766, 2008 | 83 | 2008 |
Hydrogen production by auto-thermal reforming of ethanol over Ni/γ-Al2O3 catalysts: Effect of second metal addition MH Youn, JG Seo, P Kim, JJ Kim, HI Lee, IK Song Journal of power sources 162 (2), 1270-1274, 2006 | 68 | 2006 |
Superconformal Cu electrodeposition using DPS: a substitutive accelerator for bis (3-sulfopropyl) disulfide SK Cho, SK Kim, JJ Kim Journal of the Electrochemical Society 152 (5), C330, 2005 | 67 | 2005 |
Investigation of copper deposition in the presence of benzotriazole JJ Kim, SK Kim, JU Bae Thin Solid Films 415 (1-2), 101-107, 2002 | 63 | 2002 |
Capacity variation of carbon-coated silicon monoxide negative electrode for lithium-ion batteries KW Kim, H Park, JG Lee, J Kim, YU Kim, JH Ryu, JJ Kim, SM Oh Electrochimica Acta 103, 226-230, 2013 | 61 | 2013 |
Cu bottom-up filling for through silicon vias with growing surface established by the modulation of leveler and suppressor MJ Kim, HC Kim, S Choe, JY Cho, D Lee, I Jung, WS Cho, JJ Kim Journal of the Electrochemical Society 160 (12), D3221, 2013 | 60 | 2013 |
Optimized surface pretreatments for copper electroplating JJ Kim, SK Kim Applied surface science 183 (3-4), 311-318, 2001 | 59 | 2001 |
Hydrogen production by steam reforming of liquefied natural gas (LNG) over mesoporous nickel–alumina xerogel catalysts: effect of nickel content JG Seo, MH Youn, HI Lee, JJ Kim, E Yang, JS Chung, P Kim, IK Song Chemical Engineering Journal 141 (1-3), 298-304, 2008 | 57 | 2008 |
Degradation of bis (3-sulfopropyl) disulfide and its influence on copper electrodeposition for feature filling S Choe, MJ Kim, HC Kim, SK Cho, SH Ahn, SK Kim, JJ Kim Journal of The Electrochemical Society 160 (12), D3179, 2013 | 55 | 2013 |
A comparative study on thermal stability of two solid electrolyte interphase (SEI) films on graphite negative electrode H Park, T Yoon, J Mun, JH Ryu, JJ Kim, SM Oh Journal of The Electrochemical Society 160 (9), A1539, 2013 | 55 | 2013 |
Method of catalyst coating in micro-reactors for methanol steam reforming SM Hwang, OJ Kwon, JJ Kim Applied Catalysis A: General 316 (1), 83-89, 2007 | 55 | 2007 |
Silicon-based miniaturized-reformer for portable fuel cell applications OJ Kwon, SM Hwang, JG Ahn, JJ Kim Journal of power sources 156 (2), 253-259, 2006 | 53 | 2006 |