| A high voltage high frequency resonant inverter for supplying DBD devices with short discharge current pulses X Bonnin, J Brandelero, N Videau, H Piquet, T Meynard IEEE Transactions on Power Electronics 29 (8), 4261-4269, 2013 | 56 | 2013 |
| A non-intrusive method for measuring switching losses of GaN power transistors J Brandelero, B Cougo, T Meynard, N Videau IECON 2013-39th Annual Conference of the IEEE Industrial Electronics Society …, 2013 | 53 | 2013 |
| An isolated multicell intercell transformer converter for applications with a high step-up ratio F Forest, TA Meynard, E Labouré, B Gelis, JJ Huselstein, JC Brandelero IEEE transactions on power electronics 28 (3), 1107-1119, 2012 | 46 | 2012 |
| Selective gate driving in intelligent power modules J Brandelero, J Ewanchuk, S Mollov IEEE Transactions on Power Electronics 36 (1), 898-910, 2020 | 30 | 2020 |
| Online junction temperature measurements for power cycling power modules with high switching frequencies J Brandelero, J Ewanchuk, S Mollov Power Semiconductor Devices and ICs (ISPSD), 2016 28th International …, 2016 | 29 | 2016 |
| On-line virtual junction temperature measurement via DC gate current injection J Brandelero, J Ewanchuk, S Mollov CIPS 2018; 10th International Conference on Integrated Power Electronics …, 2018 | 25 | 2018 |
| Lifetime extension of a multi-die SiC power module using selective gate driving with temperature feedforward compensation J Ewanchuk, J Brandelero, S Mollov 2017 IEEE Energy Conversion Congress and Exposition (ECCE), 2520-2526, 2017 | 23 | 2017 |
| Conception et réalisation d'un convertisseur multicellulaire DC/DC isolé pour application aéronautique JC Brandelero | 23 | 2015 |
| 5-phase interleaved buck converter with gallium nitride transistors N Videau, T Meynard, V Bley, D Flumian, E Sarraute, G Fontes, ... The 1st IEEE Workshop on Wide Bandgap Power Devices and Applications, 190-193, 2013 | 22 | 2013 |
| Accurate switching energy estimation of parallel eGaN FETs for modern aircraft applications B Cougo, H Schneider, J Brandelero, T Meynard The 1st IEEE Workshop on Wide Bandgap Power Devices and Applications, 108-111, 2013 | 21 | 2013 |
| Optimization of forced-air cooling system for accurate design of power converters A Castelan, B Cougo, J Brandelero, D Flumian, T Meynard 2015 IEEE 24th International Symposium on Industrial Electronics (ISIE), 367-372, 2015 | 20 | 2015 |
| Design of differential mode filters for two-level and multicell converters T Meynard, B Cougo, J Brandelero 2013 IEEE 11th International Workshop of Electronics, Control, Measurement …, 2013 | 14 | 2013 |
| Evaluation des pertes par commutation pour la conception des convertisseurs et applications des composants grand gap J Brandelero, B Cougo, T Meynard, N Videau, O Goualard, X Bonnin, ... Symposium de Génie Électrique 2014, 2014 | 12 | 2014 |
| Lifetime extension through Tj equalisation by use of intelligent gate driver with multi-chip power module J Brandelero, J Ewanchuk, N Degrenne, S Mollov Microelectronics Reliability 88, 428-432, 2018 | 10 | 2018 |
| A gate driver based approach to improving the current density in a power module by equalizing the individual die temperatures J Ewanchuk, J Brandelero, S Mollov 2018 IEEE Energy Conversion Congress and Exposition (ECCE), 4652-4658, 2018 | 9 | 2018 |
| Method and device for determining junction temperature of die of semiconductor power module J Ewanchuk, S Mollov, J Robinson, J Brandelero US Patent 11,448,557, 2022 | 7 | 2022 |
| Diagnostic device and method to establish degradation state of electrical connection in power semiconductor device N Degrenne, JC Brandelero US Patent 11,169,201, 2021 | 6 | 2021 |
| Improving the die utilization and lifetime in a multi-die SiC power module by means of integrated per-die gate buffers J Ewanchuk, J Brandelero, S Mollov 2017 29th International Symposium on Power Semiconductor Devices and IC's …, 2017 | 6 | 2017 |
| Conception et réalisation d’un convertisseur multicellulaire DC JC Brandelero DC isolé pour application aéronautique (Doctoral dissertation, École …, 2015 | 6 | 2015 |
| Impact of heat treatment on the lifetime of wire-bonded power modules J Brandelero, P Pichon, M Legros Microelectronics Reliability 126, 114251, 2021 | 4 | 2021 |
Jeffrey EwanchukUnited Technologies Research Center在 utrc.utc.com 的电子邮件经过验证
