| Interconnection structure and test method JR Behun, AJ Call, FF Cappo, MS Cole, KG Hoebener, BT Klingel, ... US Patent 5,147,084, 1992 | 150 | 1992 |
| Interconnection structure and test method JR Behun, AJ Call, FF Cappo, MS Cole, KG Hoebener, BT Klingel, ... US Patent 5,060,844, 1991 | 150 | 1991 |
| Ceramic column grid array for flip chip applications RN Master, MS Cole, GB Martin, A Caron 1995 Proceedings. 45th Electronic Components and Technology Conference, 925-929, 1995 | 57 | 1995 |
| A Review of Available Ball Grid Array (BGA) Packages MS Cole JOURNAL OF SURFACE MOUNT TECHNOLOGY 9, 4-11, 1996 | 53 | 1996 |
| Ball grid array packaging MS Cole, T Caulfield Surface Mount International Conference Proceedings, Surface Mount …, 1994 | 52 | 1994 |
| Ceramic BGA: A Packaging Alternative JU Knickerbocker, MS Cole Advanced Packaging, IHS Publishing Group 4 (1), 20, 1995 | 43 | 1995 |
| Low stress conductive polymer bump WE Bernier, MS Cole, MG Farooq, JU Knickerbocker, TE Lopez, RA Quon, ... US Patent 7,170,187, 2007 | 42 | 2007 |
| Constant strain rate tensile properties of various lead based solder alloys at 0, 50, and 100 C M Cole, T Caulfield Scripta metallurgica et materialia 27 (7), 903-908, 1992 | 34 | 1992 |
| Harsh environment impact on resistor reliability M Cole, L Hedlund, G Hutt, T Kiraly, L Klein, S Nickel, P Singh, T Tofil SMTAI, Orlando, FL, 2010 | 29 | 2010 |
| Shock and Vibration Limits for CBGA and CCGA MS Cole, EJ Kastberg, GB Martin SMI. Surface Mount International, 1996 | 24 | 1996 |
| CLASP ceramic column grid array technology for flip chip carriers S Ray, M Interrante, L Achard, MS Cole, I DeSousa, L Jimarez, G Martin, ... Proceedings of Semicon West 7, 99, 1999 | 23 | 1999 |
| Ceramic ball grid array for AMD K6 microprocessor application RN Master, TP Dolbear, MS Cole, GB Martin 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat …, 1998 | 23 | 1998 |
| Lead-free package interconnections for ceramic grid arrays M Interrante, J Coffin, M Cole, I De Sousa, M Farooq, L Goldmann, ... IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology …, 2003 | 21 | 2003 |
| The new millennium for CCGA-Beyond 2000 I/O MS Cole, I DeSousa, M Interrante, L Jimarez, JL Jozwiak, MS June, ... JOURNAL OF SURFACE MOUNT TECHNOLOGY 15 (1), 43-51, 2002 | 16 | 2002 |
| An overview of ceramic ball and column grid array packaging T Caulfield, M Cole, F Cappo, J Zitz, J Benenati, J Lau Ball Grid Array Technology, 131-169, 1995 | 15 | 1995 |
| Substrate thickness and CBGA fatigue life GB Martin, MS Cole, PJ Brofman, LS Goldmann Surface Mount Technology-Libertyville 12 (2), 102-109, 1998 | 14 | 1998 |
| Second-Level Assembly of Column Grid Array Packages DR Banks, CG Heim, RH Lewis, A Caron, MS Cole Proceedings of Surface Mount International, 92-98, 1993 | 14 | 1993 |
| Compressible films surrounding solder connectors WE Bernier, TJ Cheng, MS Cole, DE Eichstadt, MG Farooq, ... US Patent 7,332,821, 2008 | 13 | 2008 |
| Improvement in reliability with CCGA column density increase to 1 mm pitch EM Ingalls, M Cole, J Jozwiak, C Milkovich, J Stack 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat …, 1998 | 12 | 1998 |
| Scr. Metall. Mater. M Cole, T Caulfield Scr. Metall. Mater 27, 903-908, 1992 | 12 | 1992 |
Mukta Ghate FarooqIBM在 us.ibm.com 的电子邮件经过验证
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