Viscoelastic responses of polyhedral oligosilsesquioxane reinforced epoxy systems A Lee, JD Lichtenhan Macromolecules 31 (15), 4970-4974, 1998 | 512 | 1998 |
Thermal and viscoelastic property of epoxy–clay and hybrid inorganic–organic epoxy nanocomposites A Lee, JD Lichtenhan Journal of Applied Polymer Science 73 (10), 1993-2001, 1999 | 288 | 1999 |
Effect of crosslink density on physical ageing of epoxy networks A Lee, GB McKenna Polymer 29 (10), 1812-1817, 1988 | 205 | 1988 |
Styrene− butadiene− styrene triblock copolymers modified with polyhedral oligomeric silsesquioxanes BX Fu, A Lee, TS Haddad Macromolecules 37 (14), 5211-5218, 2004 | 175 | 2004 |
Influence of phenyl-trisilanol polyhedral silsesquioxane on properties of epoxy network glasses BX Fu, M Namani, A Lee Polymer 44 (25), 7739-7747, 2003 | 172 | 2003 |
The physical ageing response of an epoxy glass subjected to large stresses A Lee, GB McKenna Polymer 31 (3), 423-430, 1990 | 135 | 1990 |
Nanostructured chemicals as alloying agents in polymers JD Lichtenhan, JJ Schwab, A Lee, S Phillips US Patent 6,716,919, 2004 | 87 | 2004 |
Development of nanocomposite lead-free electronic solders A Lee, KN Subramanian, JG Lee Proceedings. International Symposium on Advanced Packaging Materials …, 2005 | 83 | 2005 |
Chemical substituent effects on morphological transitions in styrene− butadiene− styrene triblock copolymer grafted with polyhedral oligomeric silsesquioxanes DB Drazkowski, A Lee, TS Haddad, DJ Cookson Macromolecules 39 (5), 1854-1863, 2006 | 81 | 2006 |
New approach in the synthesis of hybrid polymers grafted with polyhedral oligomeric silsesquioxane and their physical and viscoelastic properties A Lee, J Xiao, FJ Feher Macromolecules 38 (2), 438-444, 2005 | 81 | 2005 |
A new method to reduce cure-induced stresses in thermoset polymer composites, part III: correlating stress history to viscosity, degree of cure, and cure shrinkage JD Russell, MS Madhukar, MS Genidy, AY Lee Journal of composite materials 34 (22), 1926-1947, 2000 | 77 | 2000 |
Isochoric and isobaric glass formation: Similarities and differences DM Colucci, GB McKenna, JJ Filliben, A Lee, DB Curliss, KB Bowman, ... Journal of Polymer Science Part B: Polymer Physics 35 (10), 1561-1573, 1997 | 71 | 1997 |
Nanoscale toughening of carbon fiber reinforced/epoxy polymer composites (CFRPs) using a triblock copolymer NT Kamar, LT Drzal, A Lee, P Askeland Polymer 111, 36-47, 2017 | 52 | 2017 |
FT-IR study of orientation relaxation in uniaxially oriented monodisperse atactic polystyrenes A Lee, RP Wool Macromolecules 19 (4), 1063-1068, 1986 | 52 | 1986 |
Mechanical characterization of Sn‐3.5 Ag solder joints at various temperatures H Rhee, KN Subramanian, A Lee, JG Lee Soldering & surface mount technology 15 (3), 21-26, 2003 | 51 | 2003 |
Morphology and phase transitions in styrene− butadiene− styrene triblock copolymer grafted with isobutyl-substituted polyhedral oligomeric silsesquioxanes DB Drazkowski, A Lee, TS Haddad Macromolecules 40 (8), 2798-2805, 2007 | 46 | 2007 |
Viscoelastic response of epoxy glasses subjected to different thermal treatments A Lee, GB McKenna Polymer Engineering & Science 30 (7), 431-435, 1990 | 46 | 1990 |
Electromigration in Sn-Bi modified with polyhedral oligomeric silsesquioxane R Zhang, G Xu, X Wang, F Guo, A Lee, KN Subramanian Journal of electronic materials 39, 2513-2521, 2010 | 45 | 2010 |
Thermal transitions and reaction kinetics of polyhederal silsesquioxane containing phenylethynylphthalimides B Seurer, V Vij, T Haddad, JM Mabry, A Lee Macromolecules 43 (22), 9337-9347, 2010 | 45 | 2010 |
Preparation and properties of organic/inorganic hybrid materials by blending polyhedral oligosilsesquioxanes into organic polymers RL Blanski, SH Phillips, K Chaffee, J Lichtenhan, A Lee, HP Geng Polymer Preprints(USA) 41 (1), 585-586, 2000 | 40 | 2000 |