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Andre Lee
Andre Lee
在 egr.msu.edu 的电子邮件经过验证
标题
引用次数
引用次数
年份
Viscoelastic responses of polyhedral oligosilsesquioxane reinforced epoxy systems
A Lee, JD Lichtenhan
Macromolecules 31 (15), 4970-4974, 1998
5121998
Thermal and viscoelastic property of epoxy–clay and hybrid inorganic–organic epoxy nanocomposites
A Lee, JD Lichtenhan
Journal of Applied Polymer Science 73 (10), 1993-2001, 1999
2881999
Effect of crosslink density on physical ageing of epoxy networks
A Lee, GB McKenna
Polymer 29 (10), 1812-1817, 1988
2051988
Styrene− butadiene− styrene triblock copolymers modified with polyhedral oligomeric silsesquioxanes
BX Fu, A Lee, TS Haddad
Macromolecules 37 (14), 5211-5218, 2004
1752004
Influence of phenyl-trisilanol polyhedral silsesquioxane on properties of epoxy network glasses
BX Fu, M Namani, A Lee
Polymer 44 (25), 7739-7747, 2003
1722003
The physical ageing response of an epoxy glass subjected to large stresses
A Lee, GB McKenna
Polymer 31 (3), 423-430, 1990
1351990
Nanostructured chemicals as alloying agents in polymers
JD Lichtenhan, JJ Schwab, A Lee, S Phillips
US Patent 6,716,919, 2004
872004
Development of nanocomposite lead-free electronic solders
A Lee, KN Subramanian, JG Lee
Proceedings. International Symposium on Advanced Packaging Materials …, 2005
832005
Chemical substituent effects on morphological transitions in styrene− butadiene− styrene triblock copolymer grafted with polyhedral oligomeric silsesquioxanes
DB Drazkowski, A Lee, TS Haddad, DJ Cookson
Macromolecules 39 (5), 1854-1863, 2006
812006
New approach in the synthesis of hybrid polymers grafted with polyhedral oligomeric silsesquioxane and their physical and viscoelastic properties
A Lee, J Xiao, FJ Feher
Macromolecules 38 (2), 438-444, 2005
812005
A new method to reduce cure-induced stresses in thermoset polymer composites, part III: correlating stress history to viscosity, degree of cure, and cure shrinkage
JD Russell, MS Madhukar, MS Genidy, AY Lee
Journal of composite materials 34 (22), 1926-1947, 2000
772000
Isochoric and isobaric glass formation: Similarities and differences
DM Colucci, GB McKenna, JJ Filliben, A Lee, DB Curliss, KB Bowman, ...
Journal of Polymer Science Part B: Polymer Physics 35 (10), 1561-1573, 1997
711997
Nanoscale toughening of carbon fiber reinforced/epoxy polymer composites (CFRPs) using a triblock copolymer
NT Kamar, LT Drzal, A Lee, P Askeland
Polymer 111, 36-47, 2017
522017
FT-IR study of orientation relaxation in uniaxially oriented monodisperse atactic polystyrenes
A Lee, RP Wool
Macromolecules 19 (4), 1063-1068, 1986
521986
Mechanical characterization of Sn‐3.5 Ag solder joints at various temperatures
H Rhee, KN Subramanian, A Lee, JG Lee
Soldering & surface mount technology 15 (3), 21-26, 2003
512003
Morphology and phase transitions in styrene− butadiene− styrene triblock copolymer grafted with isobutyl-substituted polyhedral oligomeric silsesquioxanes
DB Drazkowski, A Lee, TS Haddad
Macromolecules 40 (8), 2798-2805, 2007
462007
Viscoelastic response of epoxy glasses subjected to different thermal treatments
A Lee, GB McKenna
Polymer Engineering & Science 30 (7), 431-435, 1990
461990
Electromigration in Sn-Bi modified with polyhedral oligomeric silsesquioxane
R Zhang, G Xu, X Wang, F Guo, A Lee, KN Subramanian
Journal of electronic materials 39, 2513-2521, 2010
452010
Thermal transitions and reaction kinetics of polyhederal silsesquioxane containing phenylethynylphthalimides
B Seurer, V Vij, T Haddad, JM Mabry, A Lee
Macromolecules 43 (22), 9337-9347, 2010
452010
Preparation and properties of organic/inorganic hybrid materials by blending polyhedral oligosilsesquioxanes into organic polymers
RL Blanski, SH Phillips, K Chaffee, J Lichtenhan, A Lee, HP Geng
Polymer Preprints(USA) 41 (1), 585-586, 2000
402000
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