Microwave synthesis of Zn/Mg substituted and Zn/Mg-F co-substituted nanocrystalline hydroxyapatite A Saikiran, M Vivekanand, M Prahalad, S Yuvan, N Rameshbabu Materials Today: Proceedings 27, 2355-2359, 2020 | 17 | 2020 |
Materials for heterogeneous integration M Swaminathan, M Kathaperumal, K Moon, H Sharma, P Murali, ... MRS Bulletin 46 (10), 967-977, 2021 | 12 | 2021 |
Embedded inductors using composite magnetic materials for 12–1-V integrated voltage regulators CA Barros, P Murali, M Swaminathan, O Yusuke, T Junichi, N Ryo, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 10 | 2021 |
Demonstration of a high-inductance, high-density, and low DC resistance compact embedded toroidal inductor for IVR C Alvarez, P Murali, M Swaminathan, Y Oishi, J Takashiro, R Nagatsuka, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1293-1299, 2021 | 10 | 2021 |
Proposed inductor power loss metric and novel embedded toroidal inductor for integrated voltage regulators CA Barros, P Murali, M Swaminathan, O Yusuke, T Junichi, N Ryo, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 9 | 2021 |
Fabrication and characterization of package embedded inductors for integrated voltage regulators P Murali, V Avula, M Ahmed, MD Losego, M Swaminathan, C Alvarez, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 301-305, 2022 | 5 | 2022 |
Design and demonstration of dual-core spiral package-embedded inductors for 48V-to-1V and 12V-to-1V Integrated Voltage Regulators V Avula, P Murali, M Swaminathan Authorea Preprints, 2024 | | 2024 |
Package Power Delivery Architecture for High Performance Computing Systems With a 1 kW IVR Operated in CCM-DCM Boundary Mode Condition RR Khorasani, X Li, JW Kim, P Murali, R Sharma, M Swaminathan 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 285-292, 2024 | | 2024 |
Magnetic Cores for High Conversion Ratio Package Embedded Inductors SSA Venkataramanan, P Murali, DA Gilbert, M Kathaperumal, MD Losego 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2250-2255, 2024 | | 2024 |
Maskless Lithography for High-Density Package Redistribution Layers P Murali, P Nimbalkar, M Kathaperumal, MD Losego, R Tummala, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 147-151, 2023 | | 2023 |
Semi-additive patterning process based fabrication of miniaturized, package-embedded high conversion ratio inductors for DC-DC converters P Murali, C Alvarez, S Suresh, MD Losego, M Swaminathan, Y Oishi, ... Power Electronic Devices and Components 3, 100023, 2022 | | 2022 |