| Reliability of Ag Sintering for Power Semiconductor Die Attach in High Temperature Applications F Yu, J Cui, Z Zhou, RW Johnson, MC Hamilton IEEE Transactions on Power Electronics, 2016 | 136 | 2016 |
| Mechanical reliability of thick films for high-temperature packaging Z Zhou, RW Johnson, MC Hamilton IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (6 …, 2018 | 11 | 2018 |
| Investigation of Thick Film Technology for High Temperature Applications Z Zhou, J Cui, F Yu, K Fang, Z Shen, RW Johnson, A Vert, T Zhang, ... IMAPS High Temperature Electronics Conference (HiTEC), 2012 | 9 | 2012 |
| Evaluation of thick-film materials for high-temperature packaging Z Zhou, J Cui, F Yu, RW Johnson, MC Hamilton IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (5 …, 2018 | 8 | 2018 |
| DIP Test Socket Characterization for 300°C D Shaddock, L Yin, Z Shen, Z Zhou, RW Johnson IMAPS Conference & Exhibition on High Temperature Electronics Network (HiTEN …, 2013 | 4 | 2013 |
| The preparation of microcapsules used for self-healing composites R Tian, YD Zheng, X Liang, ZM Zhou, XL Fu, WT Lv Advanced Materials Research 233, 2319-2322, 2011 | 3 | 2011 |
| Conductive mechanism of bi-doped thick-film dielectric in high-temperature aging with bias Z Zhou, RW Johnson, MC Hamilton IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (5 …, 2018 | 1 | 2018 |
| Evaluation of thick film materials for high temperature electronics packaging Z Zhou, W Johnson, M Hamilton https://etd.auburn.edu/handle/10415/5733, 2017 | | 2017 |
| Component Attachment with Pressureless Ag Sintering for 300°C Applications F Yu, J Cui, Z Zhou, RW Johnson, MC Hamilton Journal of Microelectronics and Electronic Packaging, 2016 | | 2016 |
| Component Attachment with Pressureless Sintering for 300°C Applications F Yu, J Cui, Z Zhou, RW Johnson, MC Hamilton IMAPS High Temperature Electronics Conference (HiTEC 2016), 2016 | | 2016 |
| Extreme environment electronics Z Zhou, S Zou, K Fang, J Cui, F Yu, M Hamilton https://www.researchgate.net/publication …, 2013 | | 2013 |
Michael C. HamiltonJames B. Davis Professor - Electrical and Computer Engineering - Auburn University在 auburn.edu 的电子邮件经过验证
