| Resilient design of current steering DACs using a transistor level approach N Mirzaie, H Shamsi, GS Byun Analog Integrated Circuits and Signal Processing 90, 29-41, 2017 | 13 | 2017 |
| Three-dimensional pipeline ADC utilizing TSV/design optimization and memristor ratioed logic N Mirzaie, A Alzahmi, H Shamsi, GS Byun IEEE Transactions on Very Large Scale Integration (VLSI) Systems 26 (12 …, 2018 | 12 | 2018 |
| Yield‐aware sizing of pipeline ADC using a multiple‐objective evolutionary algorithm N Mirzaie, H Shamsi, GS Byun International Journal of Circuit Theory and Applications 45 (6), 744-763, 2017 | 12 | 2017 |
| A macromodeling approach for analog behavior of digital integrated circuits N Mirzaie, R Rohrer IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2020 | 9 | 2020 |
| An optimal design methodology for yield-improved and low-power pipelined ADC N Mirzaie, GS Byun IEEE Transactions on Semiconductor Manufacturing 31 (1), 130-135, 2017 | 8 | 2017 |
| Automatic design and yield enhancement of data converters N Mirzaie, H Shamsi, GS Byun Journal of Circuits, Systems and Computers 26 (01), 1750018, 2017 | 8 | 2017 |
| 3-D power delivery network’s subblocks and regulator placement optimized by evolutionary algorithm A Alzahmi, N Mirzaie, GS Byun IEEE Transactions on Components, Packaging and Manufacturing Technology 7 …, 2017 | 7 | 2017 |
| A low-power and performance-efficient SAR ADC design N Mirzaie, A Alzahmi, CC Lin, I Kim, GS Byun 2017 International SoC Design Conference (ISOCC), 3-4, 2017 | 5 | 2017 |
| Reliability-aware 3-D clock distribution network using memristor ratioed logic N Mirzaie, CC Lin, A Alzahmi, GS Byun IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (9 …, 2019 | 3 | 2019 |
| A performance-aware I/O interface for 3D stacked memory systems N Mirzaie, A Alzahmi, CC Lin, GS Byun 2017 IEEE 8th annual ubiquitous computing, electronics and mobile …, 2017 | 3 | 2017 |
| Evolving More Testable Digital Combinational Circuits. N Mirzaie, SJS Mahdavi, K Mohammadi CDES, 40-45, 2010 | 3 | 2010 |
| A 3D flash ADC structure for high-speed communication applications N Mirzaie, A Alzahmi, CC Lin, GS Byun 2018 IEEE 8th Annual Computing and Communication Workshop and Conference …, 2018 | 2 | 2018 |
| 3D IC packaging utilizing a metal structure for heat reduction, noise shielding, and high interconnect density N Mirzaie, R Rohrer 2021 22nd International Symposium on Quality Electronic Design (ISQED), 269-274, 2021 | 1 | 2021 |
| High-performance RF-interconnect for 3D stacked memory A Alzahmi, N Mirzaie, CC Lin, I Kim, GS Byun 2017 International SoC Design Conference (ISOCC), 109-110, 2017 | 1 | 2017 |
| Low-power and high-performance 2.4 GHz RF transmitter for biomedical application A Alzahmi, N Mirzaie, CC Lin, GS Byun 2017 IEEE 8th Annual Ubiquitous Computing, Electronics and Mobile …, 2017 | 1 | 2017 |
| A Reconfigurable CMOS Power Amplifier Using Adaptive Biasing Technique for Wireless Monitoring Applications CC Lin, N Mirzaie, A Alzahmi, GS Byun Journal of Semiconductor Technology and Science 19 (6), 511-516, 2019 | | 2019 |
| Performance-Aware and Power-Efficient Three Dimensional (3D) Integrated Circuit (IC) Design Utilizing Evolutionary Algorithms N Mirzaie | | 2019 |
| Design of a Pre-Distortion Power Amplifier for Ku-Band/5G Applications CC Lin, A Alzahmi, N Mirzaie, GS Byun 2018 IEEE International Conference on Electro/Information Technology (EIT …, 2018 | | 2018 |
| Amaya-Contreras, IM, see Cruz-Duarte, JM, TCPMT Nov. 2017 1804-1812 Ambasana, N., Anand, G., Gope, D., and Mutnury, B., S-Parameter and Frequency Identification Method for ANN … MS Alshahed, Z Yu, H Richter, C Harendt, JN Burghartz, A Alzahmi, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 7 …, 2017 | | 2017 |
Gyung-Su ByunInha University在 inha.ac.kr 的电子邮件经过验证
Gyung-Su ByunInha University在 inha.ac.kr 的电子邮件经过验证
Hossein ShamsiK.N. Toosi Univ. of Tech.在 eetd.kntu.ac.ir 的电子邮件经过验证