Failure and reliability analysis of a SiC power module based on stress comparison to a Si device B Hu, JO Gonzalez, L Ran, H Ren, Z Zeng, W Lai, B Gao, O Alatise, H Lu, ... IEEE Transactions on device and materials reliability 17 (4), 727-737, 2017 | 162 | 2017 |
Changes and challenges of photovoltaic inverter with silicon carbide device Z Zeng, W Shao, H Chen, B Hu, W Chen, H Li, L Ran Renewable and Sustainable Energy Reviews 78, 624-639, 2017 | 51 | 2017 |
Distributed thermal monitoring of wind turbine power electronic modules using FBG sensing technology A Mohammed, B Hu, Z Hu, S Djurović, L Ran, M Barnes, PA Mawby IEEE Sensors Journal 20 (17), 9886-9894, 2020 | 34 | 2020 |
Long-term reliability evaluation of power modules with low amplitude thermomechanical stresses and initial defects B Hu, S Konaklieva, N Kourra, MA Williams, L Ran, W Lai IEEE Journal of Emerging and Selected Topics in Power Electronics 9 (1), 602-615, 2019 | 32 | 2019 |
Heat-Flux Based Condition Monitoring of Multi-chip Power Modules Using a Two-Stage Neural Network B Hu, Z Hu, L Ran, C Ng, C Jia, P Mckeever, P Tavner, C Zhang, H Jiang, ... IEEE Transactions on Power Electronics, 2020 | 22 | 2020 |
SiC 器件在光伏逆变器中的应用与挑战 曾正, 邵伟华, 胡博容, 陈昊, 廖兴林, 陈文锁, 李辉, 冉立 中国电机工程学报 37 (1), 221-232, 2017 | 14 | 2017 |
Chances and challenges of photovoltaic inverters with silicon carbide devices Z Zheng, S Weihua, H Borong Proceedings of the CSEE 37 (1), 221-232, 2017 | 13 | 2017 |
Active current sharing of paralleled SiC MOSFETs by coupling inductors Z Zeng, W Shao, B Hu, S Kang, X Liao, H Li, L Ran Proc. CSEE 37 (7), 2068-2080, 2017 | 12 | 2017 |
Deep Learning Neural Networks for Heat-Flux Health Condition Monitoring Method of Multi-Device Power Electronics System B Hu, Z Hu, L Ran, P Mawby, C Jia, C Ng, P McKeever 2019 IEEE Energy Conversion Congress and Exposition (ECCE), 3769-3774, 2019 | 11 | 2019 |
On-off behavior control of SiC MOSFET by gate drive loops Z Zheng, S Weihua, C Hao Proceedings of the CSEE 38 (4), 1165-1176, 2018 | 11 | 2018 |
Monitoring power module solder degradation from heat dissipation in two opposite directions Z Hu, B Hu, L Ran, PJ Tavner, H Kong, PA Mawby, R Wu IEEE Transactions on Power Electronics 37 (8), 9754-9766, 2022 | 10 | 2022 |
Condition monitoring for solder layer degradation in multi‐device system based on neural network B Hu, S Konaklieva, S Xu, J Ortiz‐Gonzalez, L Ran, C Ng, P McKeever, ... The Journal of Engineering 2019 (17), 3582-3586, 2019 | 9 | 2019 |
Hybrid-mode adaptive zero-voltage switching for single-phase DC–AC conversion with paralleled SiC MOSFETs Y Jiang, Y Shen, L Shillaber, B Hu, C Jiang, T Long IEEE Transactions on Power Electronics 37 (12), 14067-14081, 2022 | 8 | 2022 |
Novel cooling technology to reduce thermal impedance and thermomechanical stress for SiC application B Hu, Z Zeng, W Shao, Q Ma, H Ren, H Li, L Ran, Z Li 2017 IEEE Applied Power Electronics Conference and Exposition (APEC), 3063-3067, 2017 | 8 | 2017 |
Loss characterization and modeling of class II multilayer ceramic capacitors: A synergic material-microstructure-device approach Y Jiang, B Hu, Y Shen, X Ren, S Sandler, S Hofmann, T Long IEEE Transactions on Power Electronics, 2023 | 5 | 2023 |
Electro-thermal limited switching frequency for parallel diodes X Li, H Jiang, B Hu, H Chen, Z Zeng, L Ran, P Mawby 2018 IEEE Energy Conversion Congress and Exposition (ECCE), 4692-4698, 2018 | 5 | 2018 |
Optically-Triggered Self-Adaptive Zero Voltage Switching B Hu, Y Jiang, L Shillaber, H Wang, C Li, T Long IEEE Transactions on Power Electronics, 2023 | 4 | 2023 |
Reliability of wind turbine power modules using high-resolution wind data reconstruction: a digital twin concept N Iosifidis, Y Zhong, B Hu, B Chen, L Ran, S Lakshminarayana, C Jia, ... 2021 IEEE Energy Conversion Congress and Exposition (ECCE), 3630-3637, 2021 | 4 | 2021 |
SiC, Si, 混合功率模块封装对比评估与失效分析 李晓玲, 曾正, 陈昊, 邵伟华, 胡博容, 冉立 中国电机工程学报 38 (16), 4823-4835, 2018 | 4 | 2018 |
Flexible and fast restart of induction motor based on DVR H Di, Z Zheng, S Weihua Electric Power Automation Equipment 37 (1), 197-203, 2017 | 4 | 2017 |