| Method and apparatus for plasma dicing a semi-conductor wafer C Johnson, D Johnson, D Pays-Volard, L Martinez, R Westerman, ... US Patent 8,802,545, 2014 | 100 | 2014 |
| Method and apparatus for plasma dicing a semi-conductor wafer C Johnson, D Johnson, D Pays-Volard, L Martinez, R Westerman, ... US Patent 8,796,154, 2014 | 86 | 2014 |
| High confinement suspended micro-ring resonators in silicon-on-insulator L Martinez, M Lipson Optics Express 14 (13), 6259-6263, 2006 | 59 | 2006 |
| Method and apparatus for plasma dicing a semi-conductor wafer C Johnson, D Johnson, D Pays-Volard, L Martinez, R Westerman, ... US Patent 8,778,806, 2014 | 51 | 2014 |
| Method and apparatus for plasma dicing a semi-conductor wafer L Martinez, D Pays-Volard, C Johnson, D Johnson, R Westerman, ... US Patent 9,070,760, 2015 | 25 | 2015 |
| Method and apparatus for plasma dicing a semi-conductor wafer R Gauldin, C Johnson, D Johnson, L Martinez, D Pays-Volard, ... US Patent 8,946,058, 2015 | 23 | 2015 |
| Method and apparatus for plasma dicing a semi-conductor wafer D Geerpuram, D Pays-Volard, L Martinez, C Johnson, D Johnson, ... US Patent 8,691,702, 2014 | 22 | 2014 |
| Method and apparatus for plasma dicing a semi-conductor wafer T Lazerand, D Pays-Volard, L Martinez, C Johnson, R Westerman, ... US Patent 9,343,365, 2016 | 21 | 2016 |
| Method and apparatus for plasma dicing a semi-conductor wafer R Gauldin, D Geerpuram, K Mackenzie, T Lazerand, D Pays-Volard, ... US Patent 9,082,839, 2015 | 21 | 2015 |
| Method and apparatus for plasma dicing a semi-conductor wafer C Johnson, D Johnson, L Martinez, D Pays-Volard, R Gauldin, ... US Patent 8,785,332, 2014 | 14 | 2014 |
| Wafer dicing using dry etching on standard tapes and frames D Lishan, T Lazerand, K Mackenzie, D Pays-Volard, L Martinez, G Grivna, ... International Symposium on Microelectronics 2014 (1), 000148-000154, 2014 | 13 | 2014 |
| Deep silicon etching: current capabilities and future directions R Westerman, L Martinez, D Pays-Volard, K Mackenzie, T Lazerand Micromachining and Microfabrication Process Technology XIX 8973, 38-51, 2014 | 11 | 2014 |
| Plasma-based die singulation processing technology KD Mackenzie, D Pays-Volard, L Martinez, C Johnson, T Lazerand, ... 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 1577-1583, 2014 | 8 | 2014 |
| Electro-optic modulator on silicon-on-insulator substrates using ring resonators S Pradhan, B Schmidt, L Martinez, Q Xu, VR Almeida, C Barrios, M Lipson Conference on Lasers and Electro-Optics, CMG2, 2005 | 8 | 2005 |
| Productivity improvement using plasma-based die singulation D Pays-Volard, L Martinez, K Mackenzie, C Johnson, T Lazerand, ... CS MANTECH Conference, 279-282, 2014 | 7 | 2014 |
| Method and apparatus for plasma dicing a semi-conductor wafer L Martinez, D Pays-Volard, C Johnson, D Johnson, R Westerman, ... US Patent 9,711,406, 2017 | 5 | 2017 |
| Method and apparatus for plasma dicing a semi-conductor wafer D Pays-Volard, L Martinez, C Johnson, D Johnson, R Westerman, ... US Patent 9,105,705, 2015 | 5 | 2015 |
| Method and apparatus for plasma dicing a semi-conductor wafer L Martinez, D Pays-Volard, C Johnson, D Johnson, R Westerman, ... US Patent 8,980,764, 2015 | 4 | 2015 |
| Systematic approach to time division multiplexed Si etch process development CW Johnson, D Johnson, L Martinez, J Plumhoff ECS Transactions 50 (46), 11, 2013 | 3 | 2013 |
| Recent Developments in Real-Time Thickness Control Of Plasma Deposited Thin Film Dielectrics Using Optical Emission Interferometry KD Mackenzie, DJ Johnson, CW Johnson, L Martinez CS MANTECH Conf, 419-422, 2013 | 2 | 2013 |
