| Whole genome sequencing reveals potential spread of Clostridium difficile between humans and farm animals in the Netherlands, 2002 to 2011 CW Knetsch, TR Connor, A Mutreja, SM Van Dorp, IM Sanders, ... Eurosurveillance 19 (45), 20954, 2014 | 240 | 2014 |
| Investigation into the application of low melting temperature alloys as wet thermal interface materials CK Roy, S Bhavnani, MC Hamilton, RW Johnson, JL Nguyen, RW Knight, ... International Journal of Heat and Mass Transfer 85, 996-1002, 2015 | 102 | 2015 |
| Wet layup and sintering of metal-containing microfibrous composites for chemical processing opportunities DK Harris, DR Cahela, BJ Tatarchuk Composites Part A: applied science and manufacturing 32 (8), 1117-1126, 2001 | 99 | 2001 |
| Measurements of the contact angle between R134a and both aluminum and copper surfaces B Vadgama, DK Harris Experimental Thermal and Fluid Science 31 (8), 979-984, 2007 | 63 | 2007 |
| Characterization of transferred vertically aligned carbon nanotubes arrays as thermal interface materials MA Peacock, CK Roy, MC Hamilton, RW Johnson, RW Knight, DK Harris International Journal of Heat and Mass Transfer 97, 94-100, 2016 | 61 | 2016 |
| Thermal performance of low melting temperature alloys at the interface between dissimilar materials CK Roy, S Bhavnani, MC Hamilton, RW Johnson, RW Knight, DK Harris Applied Thermal Engineering 99, 72-79, 2016 | 52 | 2016 |
| The heat transfer limit of step-graded metal felt heat pipe wicks RR Williams, DK Harris International Journal of Heat and mass transfer 48 (2), 293-305, 2005 | 36 | 2005 |
| Accelerated aging and thermal cycling of low melting temperature alloys as wet thermal interface materials CK Roy, S Bhavnani, MC Hamilton, RW Johnson, RW Knight, DK Harris Microelectronics Reliability 55 (12), 2698-2704, 2015 | 34 | 2015 |
| Liquid metal-filled micro heat pipes for thermal management of solid-state devices RN Dean, DK Harris, AY Palkar, GD Wonacott IEEE Transactions on Industrial Electronics 59 (12), 4888-4894, 2012 | 31 | 2012 |
| A device and technique to measure the heat transfer limit of a planar heat pipe wick RR Williams, DK Harris Experimental Thermal and Fluid Science 30 (3), 277-284, 2006 | 29 | 2006 |
| Cross-plane and in-plane porous properties measurements of thin metal felts: applications in heat pipes RR Williams, DK Harris Experimental Thermal and Fluid Science 27 (3), 227-235, 2003 | 28 | 2003 |
| Measurements of the overall heat transfer from combustion gases confined within elliptical tube heat exchangers DK Harris, VW Goldschmidt Experimental thermal and fluid science 26 (1), 33-37, 2002 | 28 | 2002 |
| Getting started with XBee RF modules M Hebel, G Bricker, D Harris Parallax inc 30, 2010 | 27 | 2010 |
| Experimental investigation of bendable heat pipes using sintered copper felt wick DD Odhekar, DK Harris Thermal and Thermomechanical Proceedings 10th Intersociety Conference on …, 2006 | 27 | 2006 |
| Effective thermal conductivity and junction factor for sintered microfibrous materials M Sheng, DR Cahela, H Yang, CF Gonzalez, WR Yantz Jr, DK Harris, ... International Journal of Heat and Mass Transfer 56 (1-2), 10-19, 2013 | 23 | 2013 |
| Effect of system and operational parameters on the performance of an immersion-cooled multichip module for high performance computing B Ramakrishnan, SH Bhavnani, J Gess, RW Knight, D Harris, ... 2014 Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM …, 2014 | 20 | 2014 |
| Impact of surface enhancements upon boiling heat transfer in a liquid immersion cooled high performance small form factor server model J Gess, S Bhavnani, B Ramakrishnan, RW Johnson, D Harris, RW Knight, ... Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 18 | 2014 |
| Molecular scale analysis of dry sliding copper asperities BN Vadgama, RL Jackson, DK Harris Applied nanoscience 5, 469-480, 2015 | 17 | 2015 |
| An Experimental Investigation in the Performance of Water-Filled Silicon Microheat Pipe Arrays DK Harris, A Palkar, G Wonacott, R Dean, F Simionescu Journal of Electronic Packaging 132 (2), 021005 1-8, 2010 | 16 | 2010 |
| Performance of low melt alloys as thermal interface materials CK Roy, S Bhavnani, M Hamilton, WR Johnson, RW Knight, DK Harris 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM …, 2015 | 15 | 2015 |
Bruce TatarchukProfessor of Chemical Engineering, Auburn University在 auburn.edu 的电子邮件经过验证
