| PbS colloidal quantum dot photodiodes for low-cost SWIR sensing EJD Klem, C Gregory, D Temple, J Lewis Infrared Technology and Applications XLI 9451, 945104, 2015 | 62 | 2015 |
| Fabrication of TSV-based silicon interposers D Malta, E Vick, S Goodwin, C Gregory, M Lueck, A Huffman, D Temple 2010 IEEE International 3D Systems Integration Conference (3DIC), 1-6, 2010 | 56 | 2010 |
| Fabrication and characterization of metal-to-metal interconnect structures for 3-D integration A Huffman, J Lannon, M Lueck, C Gregory, D Temple Journal of Instrumentation 4 (03), P03006, 2009 | 54 | 2009 |
| Planar PbS quantum dot/C60 heterojunction photovoltaic devices with 5.2% power conversion efficiency EJD Klem, CW Gregory, GB Cunningham, S Hall, DS Temple, JS Lewis Applied Physics Letters 100 (17), 173109, 2012 | 48 | 2012 |
| Extending acoustic microscopy for comprehensive failure analysis applications S Brand, P Czurratis, P Hoffrogge, D Temple, D Malta, J Reed, M Petzold Journal of Materials Science: Materials in Electronics, 1-14, 2011 | 48 | 2011 |
| Characterization of thermo-mechanical stress and reliability issues for Cu-filled TSVs D Malta, C Gregory, M Lueck, D Temple, M Krause, F Altmann, M Petzold, ... Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st, 1815 …, 2011 | 44 | 2011 |
| High density interconnect at 10µm pitch with mechanically keyed Cu/Sn-Cu and Cu-Cu bonding for 3-D integration JD Reed, M Lueck, C Gregory, A Huffman, JM Lannon, D Temple Electronic Components and Technology Conference (ECTC), 2010 Proceedings …, 2010 | 43 | 2010 |
| Integrated process for defect-free copper plating and chemical-mechanical polishing of through-silicon vias for 3D interconnects D Malta, C Gregory, D Temple, T Knutson, C Wang, T Richardson, ... Electronic Components and Technology Conference (ECTC), 2010 Proceedings …, 2010 | 43 | 2010 |
| Fabrication and testing of a TSV-enabled Si interposer with Cu-and polymer-based multilevel metallization J Lannon, A Hilton, A Huffman, M Butler, D Malta, C Gregory, D Temple IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (1 …, 2014 | 39 | 2014 |
| High density Cu-Cu interconnect bonding for 3-D integration J Lannon, C Gregory, M Lueck, A Huffman, D Temple Electronic Components and Technology Conference, 2009. ECTC 2009. 59th, 355-359, 2009 | 37 | 2009 |
| High-Density Large-Area-Array Interconnects Formed by Low-Temperature Cu/Sn–Cu Bonding for Three-Dimensional Integrated Circuits MR Lueck, JD Reed, CW Gregory, A Huffman, JM Lannon Jr, DS Temple | 35 | |
| High density metal–metal interconnect bonding for 3-D integration JM Lannon, C Gregory, M Lueck, JD Reed, CA Huffman, D Temple IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (1 …, 2012 | 29 | 2012 |
| Characterization and failure analysis of TSV interconnects: From non-destructive defect localization to material analysis with nanometer resolution M Krause, F Altmann, C Schmidt, M Petzold, D Malta, D Temple Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st, 1452 …, 2011 | 27 | 2011 |
| 66‐3: Invited Paper: Colloidal Quantum Dot Photodetectors for Large Format NIR, SWIR, and eSWIR Imaging Arrays C Gregory, A Hilton, K Violette, EJD Klem SID Symposium Digest of Technical Papers 52 (1), 982-986, 2021 | 23 | 2021 |
| Extended SWIR high performance and high definition colloidal quantum dot imagers S Hinds, E Klem, C Gregory, A Hilton, G Hames, K Violette Infrared Technology and Applications XLVI 11407, 1140707, 2020 | 17 | 2020 |
| Development of an electrochemical process for blackwater disinfection in a freestanding, additive-free toilet B Sellgren, K., Gregory, C., Hunt, M., Raut, A., Hawkins, B., Parker, C. B ... RTI Press 31 (1704), 2017 | 17 | 2017 |
| Optimization of chemistry and process parameters for void-free copper electroplating of high aspect ratio through-silicon vias for 3D integration D Malta, C Gregory, D Temple, C Wang, T Richardson, Y Zhang Electronic Components and Technology Conference, 2009. ECTC 2009. 59th, 1301 …, 2009 | 14 | 2009 |
| Low-cost SWIR sensors: advancing the performance of ROIC-integrated colloidal quantum dot photodiode arrays EJD Klem, J Lewis, C Gregory, D Temple, PS Wijewarnasuriya, N Dhar Infrared Technology and Applications XL 9070, 939-944, 2014 | 13 | 2014 |
| High-performance SWIR sensing from colloidal quantum dot photodiode arrays E Klem, J Lewis, C Gregory, G Cunningham, D Temple, A D'Souza, ... Infrared Sensors, Devices, and Applications III 8868, 886806, 2013 | 13 | 2013 |
| Colloidal quantum dot Vis-SWIR imaging: demonstration of a focal plane array and camera prototype (Presentation Recording) EJD Klem, CW Gregory, DS Temple, JS Lewis Optical Sensing, Imaging, and Photon Counting: Nanostructured Devices and …, 2015 | 11 | 2015 |
Matthew LueckRTI International在 rti.org 的电子邮件经过验证
