| Fabrication of porogen residues free and mechanically robust low-k materials AM Urbanowicz, P Verdonck, D Shamiryan, K Vanstreels, M Baklanov, ... US Patent App. 12/831,935, 2011 | 460 | 2011 |
| Plasma processing of low-k dielectrics MR Baklanov, JF de Marneffe, D Shamiryan, AM Urbanowicz, H Shi, ... Journal of Applied Physics 113 (4), 2013 | 357 | 2013 |
| Improving mechanical robustness of ultralow-k SiOCH plasma enhanced chemical vapor deposition glasses by controlled porogen decomposition prior to UV-hardening AM Urbanowicz, K Vanstreels, P Verdonck, D Shamiryan, S De Gendt, ... Journal of Applied Physics 107 (10), 2010 | 98 | 2010 |
| Effect of porogen residue on chemical, optical, and mechanical properties of CVD SiCOH low-k materials AM Urbanowicz, K Vanstreels, D Shamiryan, S De Gendt, MR Baklanov Electrochemical and Solid-State Letters 12 (8), H292, 2009 | 63 | 2009 |
| Damage reduction and sealing of low-k films by combined He and NH3 plasma treatment AM Urbanowicz, MR Baklanov, J Heijlen, Y Travaly, A Cockburn Electrochemical and Solid-State Letters 10 (10), G76, 2007 | 52 | 2007 |
| Properties of porous glasses with embedded ferroelectric materials E Rysiakiewicz-Pasek, R Poprawski, J Polanska, A Urbanowicz, ... Journal of non-crystalline solids 352 (40-41), 4309-4314, 2006 | 45 | 2006 |
| Effect of UV wavelength on the hardening process of porogen-containing and porogen-free ultralow-k plasma-enhanced chemical vapor deposition dielectrics AM Urbanowicz, K Vanstreels, P Verdonck, E Van Besien, T Christos, ... Journal of Vacuum Science & Technology B 29 (3), 2011 | 44 | 2011 |
| Effects of He plasma pretreatment on low-k damage during Cu surface cleaning with NH3 plasma AM Urbanowicz, D Shamiryan, A Zaka, P Verdonck, S De Gendt, ... Journal of the Electrochemical Society 157 (5), H565, 2010 | 37 | 2010 |
| Effect of energetic ions on plasma damage of porous SiCOH low-k materials E Kunnen, MR Baklanov, A Franquet, D Shamiryan, TV Rakhimova, ... Journal of Vacuum Science & Technology B 28 (3), 450-459, 2010 | 36 | 2010 |
| Effect of ultraviolet curing wavelength on low-k dielectric material properties and plasma damage resistance P Marsik, AM Urbanowicz, P Verdonck, D De Roest, H Sprey, ... Thin Solid Films 519 (11), 3619-3626, 2011 | 32 | 2011 |
| Nanoindentation study of thin plasma enhanced chemical vapor deposition SiCOH low-k films modified in He/H2 downstream plasma K Vanstreels, AM Urbanowicz Journal of Vacuum Science & Technology B 28 (1), 173-179, 2010 | 32 | 2010 |
| Ultraviolet-assisted curing of organosilicate glass low-k dielectric by excimer lamps S Eslava, F Iacopi, AM Urbanowicz, CEA Kirschhock, K Maex, JA Martens, ... Journal of The Electrochemical Society 155 (11), G231, 2008 | 24 | 2008 |
| Stiffening and hydrophilisation of SOG low‐k material studied by ellipsometric porosimetry, UV ellipsometry and laser‐induced surface acoustic waves AM Urbanowicz, B Meshman, D Schneider, MR Baklanov physica status solidi (a) 205 (4), 829-832, 2008 | 17 | 2008 |
| Integrated diffusion–recombination model for describing the logarithmic time dependence of plasma damage in porous low-k materials E Kunnen, GT Barkema, C Maes, D Shamiryan, A Urbanowicz, H Struyf, ... Microelectronic Engineering 88 (5), 631-634, 2011 | 15 | 2011 |
| Low dielectric constant materials: challenges of plasma damage MR Baklanov, A Urbanowicz, G Mannaert, S Vanhaelemeersch 2006 8th International Conference on Solid-State and Integrated Circuit …, 2006 | 13 | 2006 |
| Influence of the UV cure on advanced plasma enhanced chemical vapour deposition low-k materials P Verdonck, E Van Besien, K Vanstreels, C Trompoukis, A Urbanowicz, ... Japanese Journal of Applied Physics 50 (5S1), 05EB05, 2011 | 12 | 2011 |
| Moisture induced degradation of porous low-k materials MR Baklanov, D O’Dwyer, AM Urbanowicz, QT Le, S Demuynck, EK Hong MRS Online Proceedings Library 914, 1-7, 2005 | 11 | 2005 |
| Effects of bias, pressure and temperature in plasma damage of ultra low-k films AM Urbanowicz, A Humbert, G Mannaert, Z Tokei, MR Baklanov Solid State Phenomena 134, 317-320, 2008 | 9 | 2008 |
| Fullerene based materials for ultra-low-k application K Broczkowska, J Klocek, D Friedrich, K Henkel, K Kolanek, ... 2010 International Students and Young Scientists Workshop" Photonics and …, 2010 | 8 | 2010 |
| Modeling the substrate effects on nanoindentation mechanical property measurement M Gonzalez, K Vanstreels, AM Urbanowicz EuroSimE 2009-10th International Conference on Thermal, Mechanical and Multi …, 2009 | 8 | 2009 |
Mikhail Baklanov在 ncut.edu.cn 的电子邮件经过验证
