| Inductively coupled plasma source with symmetrical RF feed JA Kenney, JD Carducci, KS Collins, R Fovell, K Ramaswamy, S Rauf US Patent 9,928,987, 2018 | 317 | 2018 |
| Multiple coil inductively coupled plasma source with offset frequencies and double-walled shielding JA Kenney, JD Carducci, KS Collins, R Fovell, K Ramaswamy, S Rauf US Patent 10,170,279, 2019 | 275 | 2019 |
| Electrochemical machining with ultrashort voltage pulses: modelling of charging dynamics and feature profile evolution JA Kenney, GS Hwang Nanotechnology 16 (7), S309, 2005 | 63 | 2005 |
| Two-dimensional computational model for electrochemical micromachining with ultrashort voltage pulses JA Kenney, GS Hwang, W Shin Applied physics letters 84 (19), 3774-3776, 2004 | 48 | 2004 |
| Composite edge ring O Joubert, JA Kenney, S Srinivasan, J Rogers, R Dhindsa, ... US Patent App. 29/561,163, 2017 | 37 | 2017 |
| Etching with atomic precision by using low electron temperature plasma L Dorf, JC Wang, S Rauf, GA Monroy, Y Zhang, A Agarwal, J Kenney, ... Journal of Physics D: Applied Physics 50 (27), 274003, 2017 | 36 | 2017 |
| Three-dimensional model of magnetized capacitively coupled plasmas S Rauf, J Kenney, K Collins Journal of Applied Physics 105 (10), 2009 | 33 | 2009 |
| Influence of inhomogeneous magnetic field on the characteristics of very high frequency capacitively coupled plasmas K Bera, S Rauf, J Kenney, L Dorf, K Collins Journal of Applied Physics 107 (5), 2010 | 27 | 2010 |
| Etch trends in electrochemical machining with ultrashort voltage pulses: Predictions from theory and simulation JA Kenney, GS Hwang Electrochemical and Solid-State Letters 9 (1), D1, 2005 | 27 | 2005 |
| Three-coil inductively coupled plasma source with individually controlled coil currents from a single RF power generator L Dorf, S Rauf, J Liu, JA Kenney, A Nguyen, KS Collins, K Ramaswamy, ... US Patent 9,082,591, 2015 | 23 | 2015 |
| Three-coil inductively coupled plasma source with individually controlled coil currents from a single RF power generator L Dorf, S Rauf, J Liu, JA Kenney, A Nguyen, KS Collins, K Ramaswamy, ... US Patent 9,111,722, 2015 | 21 | 2015 |
| Prediction of stochastic behavior in differential charging of nanopatterned dielectric surfaces during plasma processing JA Kenney, GS Hwang Journal of applied physics 101 (4), 2007 | 18 | 2007 |
| Inductively coupled plasma source with multiple dielectric windows and window-supporting structure A Nguyen, KS Collins, K Ramaswamy, S Rauf, JD Carducci, ... US Patent 9,896,769, 2018 | 17 | 2018 |
| Ion energy distribution functions in a dual-frequency low-pressure capacitively-coupled plasma: experiments and particle-in-cell simulation JC Wang, P Tian, J Kenney, S Rauf, I Korolov, J Schulze Plasma Sources Science and Technology 30 (7), 075031, 2021 | 16 | 2021 |
| Symmetrical inductively coupled plasma source with coaxial RF feed and coaxial shielding JA Kenney, JD Carducci, KS Collins, R Fovell, K Ramaswamy, S Rauf US Patent 10,249,470, 2019 | 16 | 2019 |
| Symmetrical inductively coupled plasma source with side RF feeds and RF distribution plates JD Carducci, KS Collins, R Fovell, JA Kenney, K Ramaswamy, S Rauf US Patent 9,082,590, 2015 | 15 | 2015 |
| Symmetrical inductively coupled plasma source with symmetrical flow chamber A Nguyen, KS Collins, K Ramaswamy, S Rauf, JD Carducci, ... US Patent 9,745,663, 2017 | 14 | 2017 |
| Process kit having reduced erosion sensitivity JM Kim, X Zhao, JA Kenney, S Rauf US Patent App. 12/259,981, 2010 | 14 | 2010 |
| Method to modulate the wafer edge sheath in a plasma processing chamber H Wang, A Husain, K Ramaswamy, JA Kenney, J Ludwig, C Zhang, ... US Patent App. 15/957,054, 2018 | 12 | 2018 |
| Effect of segmenting powered electrode on plasma uniformity in large-area capacitively coupled plasma discharge Z Chen, J Kenney, S Rauf, K Collins, T Tanaka, N Hammond, J Kudela IEEE Transactions on Plasma Science 39 (11), 2526-2527, 2011 | 12 | 2011 |
Shahid RaufApplied Materials, Inc.在 amat.com 的电子邮件经过验证
