Autonomous robotic system for tunnel structural inspection and assessment K Loupos, AD Doulamis, C Stentoumis, E Protopapadakis, K Makantasis, ... International Journal of Intelligent Robotics and Applications 2, 43-66, 2018 | 83 | 2018 |
Experimental demonstration of an electrostatic orbital angular momentum sorter for electron beams AH Tavabi, P Rosi, E Rotunno, A Roncaglia, L Belsito, S Frabboni, ... Physical review letters 126 (9), 094802, 2021 | 51 | 2021 |
Growth and characterization of 3C-SiC films for micro electro mechanical systems (MEMS) applications M Bosi, BE Watts, G Attolini, C Ferrari, C Frigeri, G Salviati, A Poggi, ... Crystal growth & design 9 (11), 4852-4859, 2009 | 44 | 2009 |
CMOS-compatible fabrication of thermopiles with high sensitivity in the 3–5 μm atmospheric window A Roncaglia, F Mancarella, GC Cardinali Sensors and Actuators B: Chemical 125 (1), 214-223, 2007 | 40 | 2007 |
Smart integration of silicon nanowire arrays in all-silicon thermoelectric micro-nanogenerators L Fonseca, JD Santos, A Roncaglia, D Narducci, C Calaza, M Salleras, ... Semiconductor Science and Technology 31 (8), 084001, 2016 | 39 | 2016 |
Fabrication of high-resolution strain sensors based on wafer-level vacuum packaged MEMS resonators L Belsito, M Ferri, F Mancarella, L Masini, J Yan, AA Seshia, K Soga, ... Sensors and Actuators A: Physical 239, 90-101, 2016 | 35 | 2016 |
Enhancement of the power factor in two‐phase silicon–boron nanocrystalline alloys D Narducci, B Lorenzi, X Zianni, N Neophytou, S Frabboni, GC Gazzadi, ... physica status solidi (a) 211 (6), 1255-1258, 2014 | 32 | 2014 |
Robotic intelligent vision and control for tunnel inspection and evaluation-The ROBINSPECT EC project K Loupos, A Amditis, C Stentoumis, P Chrobocinski, J Victores, M Wietek, ... 2014 IEEE International Symposium on Robotic and Sensors Environments (ROSE …, 2014 | 29 | 2014 |
Thermoelectric materials in MEMS and NEMS: a review A Roncaglia, M Ferri Science of Advanced Materials 3 (3), 401-419, 2011 | 29 | 2011 |
Miniaturized fiber-optic ultrasound probes for endoscopic tissue analysis by micro-opto-mechanical technology E Vannacci, L Belsito, F Mancarella, M Ferri, GP Veronese, A Roncaglia, ... Biomedical microdevices 16, 415-426, 2014 | 28 | 2014 |
Fabrication of fiber-optic broadband ultrasound emitters by micro-opto-mechanical technology L Belsito, E Vannacci, F Mancarella, M Ferri, GP Veronese, E Biagi, ... Journal of Micromechanics and Microengineering 24 (8), 085003, 2014 | 25 | 2014 |
Adaptive K-NN for the detection of air pollutants with a sensor array A Roncaglia, I Elmi, L Dori, M Rudan IEEE Sensors Journal 4 (2), 248-256, 2004 | 24 | 2004 |
Strain sensing on steel surfaces using vacuum packaged MEMS resonators M Ferri, F Mancarell, L Belsito, A Roncaglia, J Yan, AA Seshia, K Soga, ... Procedia Engineering 5, 1426-1429, 2010 | 23 | 2010 |
Design and fabrication of very small MEMS microphone with silicon diaphragm supported by Z-shape arms using SOI wafer BA Ganji, SB Sedaghat, A Roncaglia, L Belsito Solid-State Electronics 148, 27-34, 2018 | 22 | 2018 |
Fiber optic broadband ultrasonic probe for virtual biopsy: Technological solutions E Biagi, S Cerbai, L Masotti, L Belsito, A Roncaglia, G Masetti, N Speciale Journal of Sensors 2010 (1), 917314, 2010 | 22 | 2010 |
Nanostrain resolution strain sensing by monocrystalline 3C-SiC on SOI electrostatic MEMS resonators L Belsito, M Bosi, F Mancarella, M Ferri, A Roncaglia Journal of Microelectromechanical Systems 29 (1), 117-128, 2019 | 20 | 2019 |
High-resolution strain sensing on steel by silicon-on-insulator flexural resonators fabricated with chip-level vacuum packaging L Belsito, M Ferri, F Mancarella, A Roncaglia, J Yan, AA Seshia, K Soga 2013 Transducers & Eurosensors XXVII: The 17th International Conference on …, 2013 | 20 | 2013 |
Ultradense silicon nanowire arrays produced via top-down planar technology M Ferri, F Suriano, A Roncaglia, S Solmi, GF Cerofolini, E Romano, ... Microelectronic engineering 88 (6), 877-881, 2011 | 19 | 2011 |
Emerging SiC applications beyond power electronic devices F La Via, D Alquier, F Giannazzo, T Kimoto, P Neudeck, H Ou, ... Micromachines 14 (6), 1200, 2023 | 16 | 2023 |
Fabrication and packaging techniques for the application of MEMS strain sensors to wireless crack monitoring in ageing civil infrastructures M Ferri, F Mancarella, AA Seshia, J Ransley, K Soga, J Zalesky, ... Smart Structures and Systems 6 (3), 225-238, 2010 | 15 | 2010 |