| Surface cracking in layers under biaxial, residual compressive stress S Ho, C Hillman, FF Lange, Z Suo Journal of the American Ceramic Society 78 (9), 2353-2359, 1995 | 174 | 1995 |
| Cracking of laminates subjected to biaxial tensile stresses C Hillman, Z Suo, FF Lange Journal of the American Ceramic Society 79 (8), 2127-2133, 1996 | 173 | 1996 |
| Crack bifurcation in laminar ceramic composites M Oechsner, C Hillman, FF Lange Journal of the American Ceramic Society 79 (7), 1834-1838, 1996 | 157 | 1996 |
| Failure analysis M Bazu, T Băjenescu Micro‐and Nanostructured Epoxy/Rubber Blends, 405-420, 2014 | 80 | 2014 |
| Intermetallic growth on PWBs soldered with Sn3. 8Ag0. 7Cu Y Zheng, C Hillman, P McCluskey 52nd Electronic Components and Technology Conference 2002.(Cat. No …, 2002 | 57 | 2002 |
| Silver and sulfur: case studies, physics and possible solutions C Hillman, J Arnold, S Binfield, J Seppi SMTA Inter., October, 2007 | 51 | 2007 |
| A comparison of the theory of moisture diffusion in plastic encapsulated microelectronics with moisture sensor chip and weight-gain measurements H Ardebili, C Hillman, MAE Natishan, P McCluskey, MG Pecht, ... IEEE Transactions on Components and Packaging Technologies 25 (1), 132-139, 2002 | 46 | 2002 |
| Environmental aging and deadhesion of siloxane-polyimide-epoxy adhesive S Murray, C Hillman, M Pecht IEEE Transactions on Components and Packaging Technologies 26 (3), 524-531, 2003 | 41 | 2003 |
| Environmental aging and deadhesion of polyimide dielectric films S Murray, C Hillman, M Pecht J. Electron. Packag. 126 (3), 390-397, 2004 | 35 | 2004 |
| A demonstration of virtual qualification for the design of electronic hardware J Cunningham, R Valentin, C Hillman, A Dasgupta, M Osterman Proceedings of the Institute of Environmental Sciences and Technology Meeting, 2001 | 34 | 2001 |
| Lead free solder and flex cracking failures in ceramic capacitors N Blattau, D Barker, C Hillman CARTS-CONFERENCE- 24, 101, 2004 | 30 | 2004 |
| Electrochemical migration on HASL plated FR-4 printed circuit boards E Bumiller, M Pecht, C Hillman SMTA News and Journal of Surface Mount Technology 17, 37-41, 2004 | 26 | 2004 |
| Conductive filament formation failure in a printed circuit board K Rogers, C Hillman, M Pecht, S Nachbor Circuit World 25 (3), 6-8, 1999 | 26 | 1999 |
| Second generation Pb-free alloys R Schueller, N Blattau, J Arnold, C Hillman SMTA Journal 23 (1), 18-26, 2010 | 25 | 2010 |
| Conductive filament formation: a potential reliability issue in laminated printed circuit cards with hollow fibers M Pecht, C Hillman, K Rogers, D Jennings IEEE Transactions on Electronics Packaging Manufacturing 22 (1), 80-84, 1999 | 24 | 1999 |
| A comparison of the isothermal fatigue behavior of Sn-Ag-Cu to Sn-Pb solder N Blattau, C Hillman, DR Solutions DfR Solutions, 2005 | 22 | 2005 |
| Assessing the operating reliability of land grid array elastomer sockets J Xie, C Hillman, P Sandborn, MG Pecht, A Hassenzadeh, D DeDonato IEEE Transactions on Components and Packaging Technologies 23 (1), 171-176, 2000 | 22 | 2000 |
| A review of models for time-to-failure due to metallic migration mechanisms E Bumiller, C Hillman DfR Solutions, 2009 | 21 | 2009 |
| Reliability Testing of Ni-Modified SnCu and SAC305, Accelerated Thermal Cycling J Arnold, N Blattau, C Hillman, DR Solutions, K Sweatman Resistor 1 (1), 1, 2008 | 19 | 2008 |
| An Engelmaier model for leadless ceramic chip devices with Pb-free solder N Blattau, C Hillman, DR Solutions DfR solutions, 2006 | 19 | 2006 |
Zhigang Suo (锁志刚）Harvard Princeton UCSB在 seas.harvard.edu 的电子邮件经过验证
