| Quenching stress and fracture of paraffin droplet during solidification and adhesion on metallic substrate C Kang, M Sakaguchi, A Amano, Y Kurokawa, H Inoue Surface and Coatings Technology 374, 868-877, 2019 | 12 | 2019 |
| Recoil and solidification of a paraffin droplet impacted on a metal substrate: Numerical study and experimental verification C Kang, I Ikeda, M Sakaguchi Journal of Fluids and Structures 118, 103839, 2023 | 4 | 2023 |
| Contribution of creep to strain evolution in a paraffin droplet during and after rapid solidification on a metal substrate C Kang, M Sakaguchi, H Inoue Surface and Coatings Technology 399, 126145, 2020 | 4 | 2020 |
| A butt shear joint (BSJ) specimen for high throughput testing of adhesive bonds C Kang, JJM Machado, Y Sekiguchi, M Ji, C Sato, M Naito The Journal of Adhesion 99 (14), 2080-2096, 2023 | 3 | 2023 |
| Adhesion strength of paraffin droplet impacted and solidified on metal substrate C Kang, M Sakaguchi, A Saito, H Inoue Results in Physics 34, 105310, 2022 | 2 | 2022 |
| Multi-Objective Optimization of Adhesive Joint Strength and Elastic Modulus of Adhesive Epoxy with Active Learning P Kraisornkachit, M Naito, C Kang, C Sato Materials 17 (12), 2866, 2024 | 1 | 2024 |
| Spreading dynamics associated with transient solidification of a paraffin droplet impacting a solid surface C Kang, I Ikeda, M Sakaguchi International Journal of Heat and Mass Transfer 228, 125672, 2024 | | 2024 |
| Spectral collocation method for free vibration of sandwich plates containing a viscoelastic core M Ji, C Kang, Y Sekiguchi, M Naito, C Sato Composite Structures 337, 118024, 2024 | | 2024 |
| A high-throughput technique to evaluate the probability distribution of strength of adhesively bonded joints after moisture absorption C Kang, M Ji, Y Sekiguchi, M Naito, C Sato The Journal of Adhesion, 1-23, 2023 | | 2023 |
| 基材に滴下した溶融パラフィンの凝固・密着過程での応力発達挙動と基材温度の影響 齊藤暁斗， 阪口基己， 康超， 黒川悠， 井上裕嗣 M&M 材料力学カンファレンス 2019, OS1411, 2019 | | 2019 |
| 金属基材に滴下した溶融パラフィンの凝固・密着挙動と皮膜の割れ・剥離 斉藤暁斗， 康超， 阪口基己， 黒川悠， 井上裕嗣 M&M 材料力学カンファレンス 2018, OS0508, 2018 | | 2018 |
Motoki Sakaguchi東京工業大学在 m.titech.ac.jp 的电子邮件经过验证
