| Self-assembly of a three-dimensional fibrous polymer sponge by electrospinning B Sun, YZ Long, F Yu, MM Li, HD Zhang, WJ Li, TX Xu Nanoscale 4 (6), 2134-2137, 2012 | 145 | 2012 |
| Reliability of Ag Sintering for Power Semiconductor Die Attach in High-Temperature Applications F Yu, J Cui, Z Zhou, K Fang, RW Johnson, MC Hamilton IEEE Transactions on Power Electronics 32 (9), 7083-7095, 2017 | 137 | 2017 |
| Pressureless Sintering of Microscale Silver Paste for 300 C Applications F Yu, RW Johnson, MC Hamilton IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (9 …, 2015 | 67 | 2015 |
| Pressureless, low temperature sintering of micro-scale silver paste for die attach for 300 C applications F Yu, RW Johnson, M Hamilton Additional Papers and Presentations 2014 (HITEC), 000165-000171, 2014 | 16 | 2014 |
| Investigation of Thick Film Technology for High Temperature Applications Z Zhou, J Cui, F Yu, K Fang, Z Shen, RW Johnson, A Vert, T Zhang, ... Additional Papers and Presentations 2012 (HITEC), 000184-000191, 2012 | 9 | 2012 |
| Evaluation of Thick-Film Materials for High-Temperature Packaging Z Zhou, J Cui, F Yu, RW Johnson, MC Hamilton IEEE Transactions on Components, Packaging and Manufacturing Technology, 2018 | 8 | 2018 |
| Impact of nano-diamond composites on low-temperature co-fired ceramic interposer for wide bandgap power electronic module packages S Huang, Z Xu, F Yu, SS Ang 2016 IEEE 4th Workshop on Wide Bandgap Power Devices and Applications (WiPDA …, 2016 | 7 | 2016 |
| Process Optimization of Pressure-Assisted Rapid Ag Sintering Die Attach for 300° C Applications F Yu, RW Johnson, MC Hamilton IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (6 …, 2017 | 6 | 2017 |
| Electrospun europium complex/polymer composite microfibers and its modified photoluminescence properties HX Yin, YZ Long, F Yu, SJ Zhao, XL She Materials Science Forum 688, 74-79, 2011 | 4 | 2011 |
| Low Temperature, Fast Sintering of Micro-Scale Silver Paste for Die Attach for 300° C Applications F Yu, RW Johnson, MC Hamilton International Symposium on Microelectronics 2015 (1), 000654-000660, 2015 | 3 | 2015 |
| Thin-Film Flip-Chip Assembly for High-Temperature Geothermal Application K Fang, F Yu, RW Johnson, MC Hamilton IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (2 …, 2017 | 2 | 2017 |
| Ag Sintering Die and Passive Components Attach for High Temperature Applications F Yu | | 2016 |
| Component Attachment with Pressureless Sintering for 300° C Applications F Yu, J Cui, Z Zhou, RW Johnson, MC Hamilton Additional Papers and Presentations 2016 (HiTEC), 000226-000233, 2016 | | 2016 |
