| Morphable 3D mesostructures and microelectronic devices by multistable buckling mechanics H Fu, K Nan, W Bai, W Huang, K Bai, L Lu, C Zhou, Y Liu, F Liu, J Wang, ... Nature materials 17 (3), 268-276, 2018 | 375 | 2018 |
| Highly-integrated, miniaturized, stretchable electronic systems based on stacked multilayer network materials H Song, G Luo, Z Ji, R Bo, Z Xue, D Yan, F Zhang, K Bai, J Liu, X Cheng, ... Science Advances 8 (11), eabm3785, 2022 | 129 | 2022 |
| Assembly of complex 3D structures and electronics on curved surfaces Z Xue, T Jin, S Xu, K Bai, Q He, F Zhang, X Cheng, Z Ji, W Pang, Z Shen, ... Science advances 8 (31), eabm6922, 2022 | 63 | 2022 |
| Geometrically reconfigurable 3D mesostructures and electromagnetic devices through a rational bottom-up design strategy K Bai, X Cheng, Z Xue, H Song, L Sang, F Zhang, F Liu, X Luo, W Huang, ... Science advances 6 (30), eabb7417, 2020 | 58 | 2020 |
| A soft microrobot with highly deformable 3D actuators for climbing and transitioning complex surfaces W Pang, S Xu, J Wu, R Bo, T Jin, Y Xiao, Z Liu, F Zhang, X Cheng, K Bai, ... Proceedings of the National Academy of Sciences 119 (49), e2215028119, 2022 | 49 | 2022 |
| Rapidly deployable and morphable 3D mesostructures with applications in multimodal biomedical devices F Zhang, S Li, Z Shen, X Cheng, Z Xue, H Zhang, H Song, K Bai, D Yan, ... Proceedings of the National Academy of Sciences 118 (11), e2026414118, 2021 | 38 | 2021 |
| Mechanics of bistable cross-shaped structures through loading-path controlled 3D assembly G Luo, H Fu, X Cheng, K Bai, L Shi, X He, JA Rogers, Y Huang, Y Zhang Journal of the Mechanics and Physics of Solids 129, 261-277, 2019 | 37 | 2019 |
| Design and fabrication of heterogeneous, deformable substrates for the mechanically guided 3D assembly H Luan, X Cheng, A Wang, S Zhao, K Bai, H Wang, W Pang, Z Xie, K Li, ... ACS applied materials & interfaces 11 (3), 3482-3492, 2018 | 31 | 2018 |
| Recent progress of morphable 3D mesostructures in advanced materials H Fu, K Bai, Y Huang, Y Zhang Journal of Semiconductors 41 (4), 041604, 2020 | 10 | 2020 |
| A deformation mismatch strategy enables over 120% stretchability of encapsulated serpentine silicon strips for stretchable electronics Y Shi, B Zhang, J Zhao, J Qin, K Bai, J Yu, X Zhang FlexMat 1 (2), 150-159, 2024 | | 2024 |
| Design strategy of porous elastomer substrate and encapsulation for inorganic stretchable electronics J Li, X Meng, Y Shen, J Gu, G Luo, K Bai, H Li, Z Xue International Journal of Smart and Nano Materials 15 (2), 330-347, 2024 | | 2024 |
Yihui ZhangProfessor of Engineering Mechanics, Tsinghua University在 mail.tsinghua.edu.cn 的电子邮件经过验证
