| Micro-extrusion of ECAP processed magnesium alloy for production of high strength magnesium micro-gears WJ Kim, YK Sa Scripta Materialia 54 (7), 1391-1395, 2006 | 165 | 2006 |
| Plastic forming of the equal-channel angular pressing processed 6061 aluminum alloy WJ Kim, YK Sa, HK Kim, US Yoon Materials Science and Engineering: A 487 (1-2), 360-368, 2008 | 72 | 2008 |
| Superplastic deformation and crystallization behavior of Cu54Ni6Zr22Ti18 metallic-glass sheet WJ Kim, YK Sa, JB Lee, HG Jeong Intermetallics 14 (12), 1391-1396, 2006 | 21 | 2006 |
| Joint properties of solder capped copper pillars for 3D packaging YK Sa, S Yoo, YS Shin, MK Han, CW Lee 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 17 | 2010 |
| High-strain-rate superplasticity of Zr65Al10Ni10Cu15 sheet fabricated by squeeze casting method WJ Kim, YK Sa, JB Lee, HG Jeong Intermetallics 14 (4), 377-381, 2006 | 15 | 2006 |
| Enhanced Thermo–Mechanical Reliability of Ultralow-K Dielectrics with Self-Organized Molecular Pores YK Sa Materials 14 (9), 2284, 2021 | 7 | 2021 |
| Mechanical reliability of porous low-k dielectrics for advanced interconnect: Study of the instability mechanisms in porous low-k dielectrics and their mediation through inert … Y Sa University of Texas at Arlington, 2015 | 1 | 2015 |
| Restoration of Mechanical Stability and Dielectric Constants of Porous Low-k Dielectric by Using Non-Oxidizing Plasma Treatment Y.K. Sa, Todd Ryan, Sean King, and C.-U. Kim SRC (Semiconductor Research Corporation) TECHCON, 2014 | | 2014 |
| Mechanism of Thermally-induced Morphological Change in Porous-SiCOH Dielectric for Advanced Interconnect Y.K. Sa, Todd Ryan, Sean King, and C.-U. Kim ASM (American Society of Materials), 2014 | | 2014 |
| Correlation of Structural Morphology Evolution to Restoration of Plasma-Induced Damage in Porous Low-k Dielectrics Y.K. Sa, Todd Ryan, Sean King, and C.-U. Kim TMS (The Minerals, Metals and Materials Society), 2014 | | 2014 |
| Effect of Chemical Structure Change on Thermo-Mechanical Instability of Porous Low-k Thin Films Y.K. Sa, Todd Ryan, Sean King, and C.-U. Kim TMS (The Minerals, Metals and Materials Society), 2013 | | 2013 |
| Influence of Process Conditions on the Thermo-Mechanical Instability of Porous Low-k Dielectrics and Restoration Y.K. Sa, E. Zin, Todd Ryan, Sean King, and C.-U. Kim SRC (Semiconductor Research Corporation) TECHCON, 2012 | | 2012 |
| Effect of Complex Environment on Various Lead-free Solder Joints Yong-Ho Ko, Y.K. Sa, Sehoon Yoo, C-W. Lee MS&T (Materials Science & Technology), 2010 | | 2010 |
| Vacuum Assisted TSV Filling of Pb-free Solders Young-Ki Ko, Y.K. Sa, Sehoon Yoo, Chang-Woo Lee IUMRS (International Union of Materials Research Societies), 2010 | | 2010 |
| Evaluation of Lead-free Solder Joint under Vibration and High Temperature Y.H. Ko, Y.K. Sa, Sehoon Yoo, Chang-Woo Lee IUMRS (International Union of Materials Research Societies), 2010 | | 2010 |
| Influence of Vibration at High Temperature on Lead-free Solder Joint Reliability Y.K. Sa, Sehoon Yoo, Junki Kim, Yeong K. Kim, Chang-Woo Lee PRICM7, 2010 | | 2010 |
| Joint Strength Enhancement by CNT Inserted Sn3.5Ag Solder Balls Sehoon Yoo, Young-Ki Ko, Y.K. Sa, Junghwan Bang, Chang-Woo Lee TMS (The Minerals, Metals and Materials Society), 2010 | | 2010 |
| Influence of Random Vibration on the Lead-free Solder Joint Reliability S.H. Jin, Namhyun Kang, Chang-Woo Lee, Sehoon Yoo, Y.K. Sa, WonSik Hong KIM (The Korean Institute of Metals and Materials), 2010 | | 2010 |
| Reliability of SnAg, SnCu and SnSb Solder under Vibration with Constant Temperature and Humidity Y.H. Ko, Y.K. Sa, Sehoon Yoo, Chang-Woo Lee KWJS (The Korean Welding and Joining Society), 2010 | | 2010 |
| Evaluation of Vibration Factor and Analysis of Microstructures for Lead-free Solders S.H. Jin, N.H. Kang, C.W. Lee, Y.K. Sa, S.H. Yoo, W.S. Hong KWJS (The Korean Welding and Joining Society), 2010 | | 2010 |
W. J. KimProfessor, Hongik University, Materials Sci. & Eng.在 wow.hongik.ac.kr 的电子邮件经过验证
W. J. KimProfessor, Hongik University, Materials Sci. & Eng.在 wow.hongik.ac.kr 的电子邮件经过验证
Sehoon YooKorea Institute of Industrial Technology, KITECH在 kitech.re.kr 的电子邮件经过验证
Yutaka SatoTohoku University在 material.tohoku.ac.jp 的电子邮件经过验证