| Characterization of electroplated diamond wires and the resulting workpiece quality in silicon sawing U Pala, F Kuster, K Wegener Journal of Materials Processing Technology 276, 116390, 2020 | 26 | 2020 |
| Experimental investigation of tool wear in electroplated diamond wire sawing of silicon U Pala, S Süssmaier, F Kuster, K Wegener Procedia Cirp 77, 371-374, 2018 | 25 | 2018 |
| Simulation of the ductile machining mode of silicon H Klippel, S Süssmaier, M Röthlin, M Afrasiabi, U Pala, K Wegener The International Journal of Advanced Manufacturing Technology 115, 1565-1578, 2021 | 9 | 2021 |
| Experimental Investigation and Modeling of Diamond Wire Sawing of Single-Crystal Silicon U Pala ETH Zurich, 2020 | 4 | 2020 |
| Grain flash temperatures in diamond wire sawing of silicon U Pala, S Süssmaier, K Wegener The International Journal of Advanced Manufacturing Technology, 1-10, 2021 | 3 | 2021 |
| A NOVEL METHOD FOR THE CHARACTERIZATION OF DIAMOND WIRE TOPOGRAPHY AND ABRASIVE GRAIN GEOMETRIES. U Pala, K Wegener MM Science Journal, 2019 | 1 | 2019 |
| Schnelltest für die Eignung von Diamantdraht zum Wafering U Pala, S Süssmaier, K Wegener Jahrbuch Schleifen, Honen, Läppen und Polieren: Verfahren und Maschinen. 69 …, 2020 | | 2020 |
