| High channel mobility 4H-SiC MOSFETs by antimony counter-doping A Modic, G Liu, AC Ahyi, Y Zhou, P Xu, MC Hamilton, JR Williams, ... IEEE Electron Device Letters 35 (9), 894-896, 2014 | 72 | 2014 |
| Resistive switching characteristics in printed Cu/CuO/(AgO)/Ag memristors S Zou, P Xu, MC Hamilton Electronics Letters 49 (13), 829-830, 2013 | 49 | 2013 |
| Reduced-loss ink-jet printed flexible CPW with copper coating P Xu, MC Hamilton IEEE microwave and wireless components letters 23 (4), 178-180, 2013 | 19 | 2013 |
| Fabrication and characterization of double helix structures for compliant and reworkable electrical interconnects P Xu, AH Pfeiffenberger, CD Ellis, MC Hamilton Journal of Microelectromechanical Systems 23 (5), 1219-1227, 2014 | 11 | 2014 |
| Solution-based fabrication of carbon nanotube bumps for flip-chip interconnects P Xu, F Tong, VA Davis, M Park, MC Hamilton IEEE Transactions on Nanotechnology 13 (6), 1118-1126, 2014 | 10 | 2014 |
| Electrical characteristics and density of states of thin-film transistors based on sol-gel derived ZnO channel layers with different annealing temperatures S Wang, V Mirkhani, K Yapabandara, R Cheng, G Hernandez, MP Khanal, ... Journal of Applied Physics 123 (16), 2018 | 8 | 2018 |
| Solution-deposited carbon nanotube flip chip interconnect for high-frequency applications P Xu, MC Hamilton IEEE Microwave and Wireless Components Letters 25 (4), 229-231, 2015 | 8 | 2015 |
| Bifurcation Control of Current-Mode Buck Converter via TDFC L Wei-Guo, X Ping-Ye, Z Luo-Wei, L Quan-Ming Chinese physics letters 27 (3), 2010 | 8 | 2010 |
| Flip chip based on compliant double helix interconnect for high frequency applications P Xu, GA Hernandez, S Wang, J Zhong, CD Ellis, MC Hamilton 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 1086-1090, 2014 | 3 | 2014 |
| Indium plated carbon nanotubes pattern on flexible substrate defined by ink-jet printing P Xu, MC Hamilton MRS Online Proceedings Library (OPL) 1505, mrsf12-1505-w13-12-ww07-12, 2013 | 3 | 2013 |
| Flip-chip interconnects based on solution deposited carbon nanotube bumps P Xu, MC Hamilton IEEE International Interconnect Technology Conference, 147-150, 2014 | 2 | 2014 |
| Design and fabrication of MEMS-type compliant overhang flip-chip interconnect for RF applications P Xu, MC Hamilton Additional Papers and Presentations 2015 (DPC), 002082-002094, 2015 | | 2015 |
| Fabrication and characterization of compliant off-chip double helix and carbon nanotube interconnect P Xu Auburn University, 2014 | | 2014 |
| In-Coated Carbon Nanotubes for Flexible Interconnects P Xu, MC Hamilton Additional Papers and Presentations 2012 (DPC), 000968-000985, 2012 | | 2012 |
