| Comparative study of high ambient inlet temperature effects on the performance of air vs. liquid cooled IT equipment M Sahini, U Chowdhury, A Siddarth, T Pradip, D Agonafer, R Zeigham, ... 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017 | 25 | 2017 |
| Study of Air Flow Energy within Data Center room and sizing of hot aisle Containment for an Active vs Passive cooling design M Sahini, E Kumar, T Gao, C Ingalz, A Heydari, S Xiaogang 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 21 | 2016 |
| Rack-level study of hybrid cooled servers using warm water cooling for distributed vs. centralized pumping systems M Sahini, C Kshirsagar, M Kumar, D Agonafer, J Fernandes, J Na, ... 2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM …, 2017 | 18 | 2017 |
| Innovative server rack design with bottom located cooling unit T Gao, E Kumar, M Sahini, C Ingalz, A Heydari, W Lu, X Sun 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 18 | 2016 |
| Liquid-assisted bottom air cooling of electronic racks in data centers A Heydari, EM Kumar, CJ Ingalz, W Lu, T Gao, M Sahini, Y Cui US Patent 9,635,785, 2017 | 10 | 2017 |
| Characterization of an isolated hybrid cooled server with failure scenarios using warm water cooling U Chowdhury, M Sahini, A Siddarth, D Agonafer, S Branton International Electronic Packaging Technical Conference and Exhibition 58097 …, 2017 | 8 | 2017 |
| Experimental and computational study of multi-level cooling systems at elevated coolant temperatures in data centers M Sahini | 4 | 2017 |
| Raising Inlet air temperature for a hybrid-cooled server retrofitted with liquid cooled cold plates U Chowdhury, A Siddarth, M Sahini, D Agonafer ASME International Mechanical Engineering Congress and Exposition 52125 …, 2018 | 3 | 2018 |
| Rack-Level Study of Hybrid Cooled Servers Using Warm Water Cooling With Variable Pumping for Centralized Coolant System M Sahini, C Kshirsagar, P McGinn, D Agonafer International Electronic Packaging Technical Conference and Exhibition 51920 …, 2018 | 3 | 2018 |
| Liquid-assisted bottom air cooling of electronic racks in data centers A Heydari, EM Kumar, CJ Ingalz, WW Lu, T Gao, M Sahini, Y Cui US Patent 9,848,516, 2017 | 3 | 2017 |
| Thermal performance evaluation of three types of novel end-of-aisle cooling systems M Sahini, D Agonafer, V Pandiyan International Electronic Packaging Technical Conference and Exhibition 58097 …, 2017 | 3 | 2017 |
| Thermal Performance Evaluation of a New Close-Coupled Cooling Solution including Cooling Failure Analysis M Sahini, D Agonafer Journal of Microelectronics and Electronic Packaging 15 (1), 21-34, 2018 | 1 | 2018 |
| Thermal modeling of remote radio head units M Sahini, B Gebrehiwot, D Agonafer, R Colapietro International Electronic Packaging Technical Conference and Exhibition 56888 …, 2015 | 1 | 2015 |
| Journal of Microelectronics and Electronic Packaging M Sahini, D Agonafer Thermal Performance Evaluation of a New Close-Coupled Cooling Solution …, 2018 | | 2018 |
Ashwin SiddarthThermal Engineer - Advanced Micro Devices Inc.在 amd.com 的电子邮件经过验证
