| Effect of copper TSV annealing on via protrusion for TSV wafer fabrication A Heryanto, WN Putra, A Trigg, S Gao, WS Kwon, FX Che, XF Ang, J Wei, ... Journal of electronic materials 41, 2533-2542, 2012 | 184 | 2012 |
| Study on Cu protrusion of through-silicon via FX Che, WN Putra, A Heryanto, A Trigg, X Zhang, CL Gan IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (5 …, 2013 | 105 | 2013 |
| The effect of stress migration on electromigration in dual damascene copper interconnects A Heryanto, KL Pey, YK Lim, W Liu, N Raghavan, J Wei, CL Gan, MK Lim, ... Journal of Applied Physics 109 (1), 2011 | 28 | 2011 |
| Numerical and experimental study on Cu protrusion of Cu-filled through-silicon vias (TSV) FX Che, WN Putra, A Heryanto, A Trigg, S Gao, CL Gan 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE …, 2012 | 16 | 2012 |
| Study of stress migration and electromigration interaction in copper/low-κ interconnects A Heryanto, KL Pey, YK Lim, W Liu, J Wei, N Raghavan, JB Tan, DK Sohn 2010 IEEE International Reliability Physics Symposium, 586-590, 2010 | 15 | 2010 |
| Stress migration risk on electromigration reliability in advanced narrow line copper interconnects A Heryanto, KL Pey, YK Lim, N Raghavan, W Liu, J Wei, CL Gan, JB Tan Journal of Applied Physics 110 (8), 2011 | 9 | 2011 |
| The effects of dielectric slots on Copper/Low-k interconnects reliability A Heryanto, YK Lim, KL Pey, W Liu, JB Tan, DK Sohn, LC Hsia 2009 IEEE International Interconnect Technology Conference, 92-94, 2009 | 1 | 2009 |
| Method for making non-volatile memory device A Heryanto, EH Toh, SUN Yongshun, YL Lim, SL Chwa US Patent 10,475,803, 2019 | | 2019 |
| Effect of stress migration on electromigration for nano scale advanced interconnects A Heryanto | | 2012 |
| Microstructural Evolution of Copper TSV During Annealing and its Effect on the Via Protrusion for TSV Wafer Fabrication A Heryanto, WN Putra, A Trigg, S Gao, FX Che, WS Kwon, XF Ang, J Wei, ... International Conference on Materials for Advanced Technology (ICMAT), 2011 | | 2011 |
| Three-dimensional (3D) finite element modeling of stress distribution and migration in Cu interconnects A Heryanto | | 2007 |
