| Solder joint fatigue models: review and applicability to chip scale packages WW Lee, LT Nguyen, GS Selvaduray Microelectronics reliability 40 (2), 231-244, 2000 | 687 | 2000 |
| Stacked multi-chip modules and method of manufacturing HP Takiar, PC Lin, LT Nguyen US Patent 5,422,435, 1995 | 384 | 1995 |
| Plastic-encapsulated microelectronics: materials, processes, quality, reliability, and applications M Pecht, LT Nguyen, EB Hakim (No Title), 1995 | 283 | 1995 |
| Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffraction WJ Choi, TY Lee, KN Tu, N Tamura, RS Celestre, AA MacDowell, ... Acta Materialia 51 (20), 6253-6261, 2003 | 224 | 2003 |
| Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints L Zhang, S Ou, J Huang, KN Tu, S Gee, L Nguyen Applied physics letters 88 (1), 2006 | 202 | 2006 |
| Tin whiskers studied by focused ion beam imaging and transmission electron microscopy GTT Sheng, CF Hu, WJ Choi, KN Tu, YY Bong, L Nguyen Journal of Applied Physics 92 (1), 64-69, 2002 | 176 | 2002 |
| Low cost die sized module for imaging application having a lens housing assembly H Takiar, A Prabhu, L Nguyen US Patent 6,384,397, 2002 | 167 | 2002 |
| Aging and creep behavior of Sn3. 9Ag0. 6Cu solder alloy Q Xiao, L Nguyen, WD Armstrong 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004 | 129 | 2004 |
| Techniques for wafer level molding of underfill encapsulant L Nguyen, HP Takiar, E Warner, S Mostafazadeh, JO Smith US Patent 6,245,595, 2001 | 118 | 2001 |
| Method and apparatus for forming a plastic chip on chip package module L Nguyen, A Prabhu, N Kelkar, HP Takiar US Patent 6,238,949, 2001 | 117 | 2001 |
| Optimization of copper wire bonding on Al-Cu metallization LT Nguyen, D McDonald, AR Danker, P Ng IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1995 | 100 | 1995 |
| Underfill of flip chip on laminates: simulation and validation L Nguyen, C Quentin, P Fine, B Cobb, S Bayyuk, H Yang, ... IEEE Transactions on Components and Packaging Technologies 22 (2), 168-176, 1999 | 97 | 1999 |
| Method of and arrangement for bond wire connecting together certain integrated circuit components RJ Mathew, A Smith, LT Nguyen US Patent 5,328,079, 1994 | 97 | 1994 |
| Drop test reliability of wafer level chip scale packages M Alajoki, L Nguyen, J Kivilahti Proceedings Electronic Components and Technology, 2005. ECTC'05., 637-644, 2005 | 79 | 2005 |
| Structure and kinetics of Sn whisker growth on Pb-free solder finish WJ Choi, TY Lee, KN Tu, N Tamura, RS Celestre, AA MacDowell, ... 52nd Electronic Components and Technology Conference 2002.(Cat. No …, 2002 | 79 | 2002 |
| Reliability of postmolded IC packages LT Nguyen | 78 | 1993 |
| Flip chip underfill flow characteristics and prediction P Fine, B Cobb, L Nguyen IEEE Transactions on Components and Packaging Technologies 23 (3), 420-427, 2000 | 71 | 2000 |
| Flow modeling of wire sweep during molding of integrated circuits LT Nguyen ASME 1992 EEP-vol. 2/PED-vol. 60, Manuf. Electro. Pkg., 27-38, 1992 | 64 | 1992 |
| New characterization techniques for thin polymer films HH Tong, LT Nguyen (No Title), 1990 | 64 | 1990 |
| Leadframe having die attach pad with delamination and crack-arresting features LT Nguyen, V Gumaste US Patent 7,808,089, 2010 | 62 | 2010 |
