受强制性开放获取政策约束的文章 - Luu Nguyen了解详情
无法在其他位置公开访问的文章：9 篇
3-D numerical multiphysics model for Cu-Al wire bond corrosion
P Lall, Y Zhang, J Suhling, L Nguyen
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019
强制性开放获取政策： US National Science Foundation
Numerical multiphysics model for cu-al wire bond corrosion subjected to highly-accelerated stress test
P Lall, Y Luo, L Nguyen
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1628-1638, 2018
强制性开放获取政策： US National Science Foundation
A novel numerical multiphysics framework for the modeling of Cu-Al wire bond corrosion under HAST conditions
P Lall, Y Luo, L Nguyen
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018
强制性开放获取政策： US National Science Foundation
Effect of EMCs on the high current reliability of Cu wirebonds operating in harsh environments
P Lall, S Deshpande, L Nguyen
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017
强制性开放获取政策： US National Science Foundation
Study of the Effect of Solder-Joint Voiding using X-ray MicroCT Data-based FE Models with Experimental Validation
P Lall, N Kothari, S Deshpande, L Nguyen
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019
强制性开放获取政策： US National Science Foundation
Study of electromigration in Cu and Ag wirebonds operating at high current in extreme environments
P Lall, S Deshpande, L Nguyen
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017
强制性开放获取政策： US National Science Foundation
Model for Interaction of EMC Formulation with Operating Current and Reliability of Cu-Al Wirebonds Operating in Harsh Environments
P Lall, S Deshpande, Y Luo, L Nguyen
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 815-826, 2017
强制性开放获取政策： US National Science Foundation
TMT's attention towards space and firms R&D investment: CLIWC to extract psychological features
X Wang, S Chen, LT Nguyen
Proceedings of the 2nd International Conference on Computer Science and …, 2018
强制性开放获取政策： 国家自然科学基金委员会
Copper, Silver, and PCC Wirebonds Reliability in Automotive Underhood Environments
P Lall, S Deshpande, L Nguyen
International Electronic Packaging Technical Conference and Exhibition 51920 …, 2018
强制性开放获取政策： US National Science Foundation
可在其他位置公开访问的文章：7 篇
Defect‐induced gas adsorption on graphene transistors
Y Liu, H Liu, Y Chu, Y Cui, T Hayasaka, V Dasaka, L Nguyen, L Lin
Advanced Materials Interfaces 5 (9), 1701640, 2018
强制性开放获取政策： US National Science Foundation
Reliability of copper, gold, silver, and PCC wirebonds subjected to harsh environment
P Lall, S Deshpande, L Nguyen
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 724-734, 2018
强制性开放获取政策： US National Science Foundation
Effect of Thermal Cycling on Reliability of QFN Packages
P Lall, S Deshpande, N Kothari, J Suhling, L Nguyen
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018
强制性开放获取政策： US National Science Foundation
CEO temporal focus and corporate philanthropy: The moderating role of ownership
LT Nguyen, S Chen, HK Kwan
Sage Open 11 (1), 21582440211004126, 2021
强制性开放获取政策： 国家自然科学基金委员会
Effect of Green EMCs on Fatigue Reliability of Molded Cu Wirebond System
P Lall, S Deshpande, N Kothari, L Nguyen
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018
强制性开放获取政策： US National Science Foundation
COMPARISON OF RELIABILITY OF COPPER, GOLD, SILVER, AND PCC WIREBONDS UNDER SUSTAINED OPERATION AT 200 C
P Lall, S Deshpande, L Nguyen
Proceedings of SMTA International, 2018
强制性开放获取政策： US National Science Foundation
Development of Model for Identification of Process Parameters for Wet Decapsulation of Copper–Aluminum Wirebond in PEMs
P Lall, S Deshpande, L Nguyen
IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (8 …, 2017
强制性开放获取政策： US National Science Foundation
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