| Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders S Wiese, KJ Wolter Microelectronics reliability 44 (12), 1923-1931, 2004 | 145 | 2004 |
| Microstructural dependence of constitutive properties of eutectic SnAg and SnAgCu solders S Wiese, E Meusel, KJ Wolter 53rd Electronic Components and Technology Conference, 2003. Proceedings …, 2003 | 141 | 2003 |
| Creep of thermally aged SnAgCu-solder joints S Wiese, KJ Wolter Microelectronics Reliability 47 (2-3), 223-232, 2007 | 110 | 2007 |
| Simulation-based optimization vs. mathematical programming: A hybrid approach for optimizing scheduling problems A Klemmt, S Horn, G Weigert, KJ Wolter Robotics and Computer-Integrated Manufacturing 25 (6), 917-925, 2009 | 80 | 2009 |
| Degradation of Cu6Sn5 intermetallic compound by pore formation in solid–liquid interdiffusion Cu/Sn microbump interconnects I Panchenko, K Croes, I De Wolf, J De Messemaeker, E Beyne, KJ Wolter Microelectronic engineering 117, 26-34, 2014 | 69 | 2014 |
| Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling H Chen, M Mueller, TT Mattila, J Li, X Liu, KJ Wolter, M Paulasto-Kröckel Journal of Materials Research 26 (16), 2103-2116, 2011 | 69 | 2011 |
| The effect of downscaling the dimensions of solder interconnects on their creep properties S Wiese, M Roellig, M Mueller, KJ Wolter Microelectronics Reliability 48 (6), 843-850, 2008 | 57 | 2008 |
| Effect of composition and cooling rate on the microstructure of SnAgCu-solder joints M Mueller, S Wiese, M Roellig, KJ Wolter 2007 Proceedings 57th Electronic Components and Technology Conference, 1579-1588, 2007 | 51 | 2007 |
| Investigations of carbon nanotubes epoxy composites for electronics packaging M Heimann, M Wirts-Ruetters, B Boehme, KJ Wolter 2008 58th Electronic Components and Technology Conference, 1731-1736, 2008 | 48 | 2008 |
| Microelectronic joining processes with bonding material application B Haba, KJ Wolter US Patent 6,492,251, 2002 | 48 | 2002 |
| Carbon nanotube composites for electronic packaging applications: a review L Aryasomayajula, KJ Wolter Journal of Nanotechnology 2013 (1), 296517, 2013 | 46 | 2013 |
| Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept M Roellig, R Dudek, S Wiese, B Boehme, B Wunderle, KJ Wolter, ... Microelectronics Reliability 47 (2-3), 187-195, 2007 | 37 | 2007 |
| Surface crack detection in ferritic and austenitic steel components using inductive heated thermography M Noethen, KJ Wolter, N Meyendorf 33rd International Spring Seminar on Electronics Technology, ISSE 2010, 249-254, 2010 | 36 | 2010 |
| Embedded passive components for MCM LJ Golonka, KJ Wolter, A Dziedzic, J Kita, L Rebenklau 24th International Spring Seminar on Electronics Technology. Concurrent …, 2001 | 35 | 2001 |
| Joining semiconductor units with bonding material B Haba, KJ Wolter US Patent 6,750,539, 2004 | 33 | 2004 |
| Realization of LTCC-multilayer with special cavity applications R Bauer, M Luniak, L Rebenklau, KJ Wolter, W Sauer SPIE proceedings series, 659-664, 1997 | 32 | 1997 |
| Reliability of copper-ribbons in photovoltaic modules under thermo-mechanical loading R Meier, F Kraemer, S Wiese, KJ Wolter, J Bagdahn 2010 35th IEEE Photovoltaic Specialists Conference, 001283-001288, 2010 | 31 | 2010 |
| Creep measurements of 200 μm-400 μm solder joints M Rollig, S Wiese, K Meier, KJ Wolter 2007 International Conference on Thermal, Mechanical and Multi-Physics …, 2007 | 27 | 2007 |
| Creep of eutectic SnAgCu in thermally treated solder joints S Wiese, M Roellig, KJ Wolter Proceedings Electronic Components and Technology, 2005. ECTC'05., 1272-1281, 2005 | 27 | 2005 |
| Fodel microresistors––processing and basic electrical properties A Dziedzic, L Rebenklau, LJ Golonka, KJ Wolter Microelectronics Reliability 43 (3), 377-383, 2003 | 27 | 2003 |
Henning HeuerProf. Dr.-Ing., TU Dresden, Fraunhofer IKTS Dresden在 ikts.fraunhofer.de 的电子邮件经过验证
