| Effect of Ni(P) thickness in Au/Pd/Ni(P) surface finish on the electrical reliability of Sn-3.0Ag-0.5Cu solder joints during current-stressing J Kim, SB Jung, JW Yoon Journal of Alloys and Compounds 850 (1), 156729, 2021 | 30 | 2021 |
| Electromigration behaviors of Sn58% Bi solder containing Ag-coated MWCNTs with OSP surface finished PCB J Kim, KH Jung, JH Kim, CJ Lee, SB Jung Journal of Alloys and Compounds 775, 581-588, 2019 | 27 | 2019 |
| Effects of crystalline and amorphous Pd layers on initial interfacial reactions at Sn-3.0Ag-0.5Cu/thin-Au/Pd/Ni(P) solder joints J Kim, SB Jung, JW Yoon Applied surface science 503, 144339, 2020 | 22 | 2020 |
| Effects of aging treatment on mechanical properties of Sn-58Bi epoxy solder on ENEPIG-surface-finished PCB J Kim, WR Myung, SB Jung Journal of electronic materials 45, 5895-5903, 2016 | 20 | 2016 |
| Optimal Ni (P) thickness and reliability evaluation of thin-Au/Pd (P)/Ni (P) surface-finish with Sn-3.0 Ag-0.5 Cu solder joints J Kim, SB Jung, JW Yoon Journal of Alloys and Compounds 805 (1), 1013-1024, 2019 | 18 | 2019 |
| Effects of a phosphorous-containing Pd layer in a thin-ENEPIG surface finish on the interfacial reactions and mechanical strength of a Sn–58Bi solder joint J Kim, SB Jung, JW Yoon Journal of Alloys and Compounds 820, 153396, 2020 | 15 | 2020 |
| Effect of Aging treatment and Epoxy on Bonding Strength of Sn-58Bi solder and OSP-finished PCB J Kim, WR Myung, SB Jung Journal of the Microelectronics and Packaging Society 21 (4), 97-103, 2014 | 11 | 2014 |
| Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding YHK G. Jeong, D. Y. Yu, S. Baek, J. Bang, T. I. Lee, S. B. Jung, J. Kim Materials, 2021 | 10 | 2021 |
| Interfacial reactions and mechanical properties of transient liquid-phase bonding joints in Cu/Sn/Ni(P) and Ni/Sn/(OSP)Cu structures for power modules YHK S. Baek, G. W. Jeong, J. H. Son, M. S. Kim, H. B. R. Lee, J. Kim Journal of Materials Science: Materials in Electronics, 2021 | 8 | 2021 |
| Fabrication of Ag circuit embedded in PDMS substrate and its mechanical and electrical property with variations of photonic energy K.H Jung, J Kim, B.G. Park, C.J. Lee, H. J. Sung, S. B. Jung Journal of Alloys and Compounds 748, 898-904, 2018 | 5 | 2018 |
| Interfacial reactions and mechanical properties of Sn–3.0Ag–0.5Cu solder with pure Pd or Pd(P) layers containing thin-Au/Pd/Ni(P) surface-finished PCBs during aging J Kim, JH Back, SB Jung, JW Yoon Journal of Material Science : Materials in Electronics 31 (1), 4027-4039, 2020 | 4 | 2020 |
| Effective (Pd, Ni) Sn4 diffusion barrier to suppress brittle fracture at Sn-58Bi-xAg solder joint with Ni (P)/Pd (P)/Au metallization pad J Kim, DY Park, B Ahn, J Bang, MS Kim, HS Park, Y Sohn, YH Ko Microelectronics Reliability 129, 114472, 2022 | 3 | 2022 |
| Effect of Ar Plasma Treatment for Surface of Insert Metal on Property of TLP Bonding Joint for Power Module S. Baek, D.Y. Yu, J.H. Son, J. Bang, J. Kim, M. S. Kim, H.B.R. Lee, Y. H. Ko Journal of Welding and Joining, 2020 | 3 | 2020 |
| Effects of Ni layer thickness of thin-ENEPIG surface finishes on the interfacial reactions and shear strength of Sn-3.0 Ag–0.5 Cu solder joints during aging J Kim, JH Back, SB Jung, JW Yoon Journal of Materials Science: Materials in Electronics 30 (14), 12911-12923, 2019 | 3 | 2019 |
| Microstructure and mechanical properties of Ag nanoparticles-modified Sn–58Bi/Cu solder joints during liquid-state reaction DY Park, J Kim, DY Yu, S Yoo, HS Park, Y Sohn, YH Ko Journal of Materials Science: Materials in Electronics 32, 28346-28357, 2021 | 1 | 2021 |
| Effects of Ni(P) layer thickness and Pdlayer type in thin-Au/Pd/Ni(P) surface finishes on interfacial reactions andmechanical strength of Sn–58Bi solder joints during aging J Kim, SB Jung, JW Yoon Journal of Materials Science : Materials in Electronics, 2020 | 1 | 2020 |
| Joint reliability of Al wire bonding on OSP and ENIG surface-finished substrates under complex stress induced with current and temperature YHK Byeongjin Ahn, Jahyeon Kim, Gyeong-Yeong Cheon, Tae-Ik Lee, Young-Bae ... Journal of Material science: Material in electronics, 2022 | | 2022 |
seung-boo jungProfessor of Materials Science and Engineering, Sungkyunkwan University在 skku.edu 的电子邮件经过验证
