| Principles of electronic packaging DP Seraphim, R Lasky, CY Li, PA Engel Journal of Electronic Packaging 111 (2), 162-163, 1989 | 508 | 1989 |
| Case‐II diffusion in polymers. I. Transient swelling CY Hui, KC Wu, RC Lasky, EJ Kramer Journal of Applied Physics 61 (11), 5129-5136, 1987 | 228 | 1987 |
| Case‐II diffusion in polymers. II. Steady‐state front motion CY Hui, KC Wu, RC Lasky, EJ Kramer Journal of Applied Physics 61 (11), 5137-5149, 1987 | 197 | 1987 |
| The initial stages of Case II diffusion at low penetrant activities RC Lasky, EJ Kramer, CY Hui Polymer 29 (4), 673-679, 1988 | 102 | 1988 |
| Moisture solubility and diffusion in epoxy and epoxy-glass composites LL Marsh, R Lasky, DP Seraphim, GS Springer IBM Journal of Research and Development 28 (6), 655-661, 1984 | 96 | 1984 |
| Case II diffusion: Effect of solvent molecule size TP Gall, RC Lasky, EJ Kramer Polymer 31 (8), 1491-1499, 1990 | 89 | 1990 |
| Multiple levers for overcoming the recalcitrance of lignocellulosic biomass EK Holwerda, RS Worthen, N Kothari, RC Lasky, BH Davison, C Fu, ... Biotechnology for biofuels 12, 1-12, 2019 | 85 | 2019 |
| Low cost, mode-field matched, high performance laser transmitter optical subassembly RC Lasky, S Johnson IV US Patent 5,631,987, 1997 | 67 | 1997 |
| Temperature dependence of case II diffusion RC Lasky, EJ Kramer, CY Hui Polymer 29 (6), 1131-1136, 1988 | 64 | 1988 |
| Optoelectronics for data communication RC Lasky, UL Osterberg, DP Stigliani Elsevier, 1995 | 29 | 1995 |
| High speed electronic assembly system and method GT Freeman, RC Lasky, RJ Balog, J Belmonte, TC Prentice, BP Prescott US Patent 6,572,702, 2003 | 27 | 2003 |
| iNEMI project on process development of BiSn-based low temperature solder pastes H Fu, R Aspandiar, J Chen, S Cheng, Q Chen, R Coyle, S Feng, ... Proceedings of the 2017 SMTA International Conference, Rosemont, IL, 207-220, 2017 | 23 | 2017 |
| Solvent-Probe NMR. Imaging of Polyethylene Rods 2521 J C Hui, K Wu, R Lasky, EJ Kramer Appl. Phys 61, 5137, 1987 | 21 | 1987 |
| Best practices reflow profiling for lead-free SMT assembly E Briggs, R Lasky SMTA International Conference 2009, 2009 | 20 | 2009 |
| Time and the twin paradox RC Lasky Scientific American 27, 30-33, 2018 | 19 | 2018 |
| Principles of Electronic Packaging PS Ho, DP Seraphim, R Lasky, CY Li McGraw-Hill, New York, 809, 1989 | 14 | 1989 |
| Weibull distribution and analysis: 2019 NL Clement, RC Lasky 2020 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-5, 2020 | 13 | 2020 |
| Tin pest: a forgotten issue in lead free soldering RC Lasky 2004 SMTA international conference proceedings, Chicago, IL, 838-840, 2004 | 13 | 2004 |
| Growth continues for passive components R Lasky Electronic packaging and production 38 (3), 77-78, 1998 | 11 | 1998 |
| Throughput: The critical cost variable in DCA assembly RC Lasky, DF Baldwin Proceedings of Emerging Packaging Technologies (SMTA Nat. Symposium), 1, 1996 | 11 | 1996 |
