| Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server H Modi, P Shahi, LSR Chinthaparthy, G Gupta, P Bansode, ... International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 9 | 2022 |
| Accelerated performance degradation of single-phase cold plates for direct-to-chip liquid cooled data centers LSR Chinthaparthy The University of Texas at Arlington, 2021 | 2 | 2021 |
| Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers P Shahi, A Heydari, B Eslami, V Radmard, C Hinge, H Modi, ... Journal of Electronic Packaging 146 (4), 2024 | 1 | 2024 |
| Study on the Characterization of Filters for a Direct-to-Chip Liquid Cooling System P Shahi, A Heydari, H Modi, LSR Chinthaparthy, A Barigala, Q Soud, ... 2024 40th Semiconductor Thermal Measurement, Modeling & Management Symposium …, 2024 | 1 | 2024 |
| Parametric Multi-Objective Optimization of Cold Plate for Single-Phase Immersion Cooling VS Simon, G Joseph, A Barigala, S Saini, P Shahi, LSR Chinthaparthy, ... International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023 | 1 | 2023 |
| Accelerated Degradation Of Copper Cold Plates In Direct-to-Chip Liquid Cooling in Data Centers. LSAIR CHINTHAPARTHY, S SAINI, P SHAHI, PV BANSODE, HG MODI, ... ASHRAE Journal 66 (2), 2024 | | 2024 |
| Thermal, Hydraulic and Reliability Analysis of Single-Phase Liquid Coolants for Direct-to-Chip Cold Plate Cooling in High-Performance Computing Systems P Shahi, A Heydari, C Hinge, LSR Chinthaparthy, H Modi, H Miyamura, ... International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023 | | 2023 |
