| Effects of local grain misorientation and β-Sn elastic anisotropy on whisker and hillock formation P Sarobol, WH Chen, AE Pedigo, P Su, JE Blendell, CA Handwerker Journal of Materials Research 28 (5), 747-756, 2013 | 27 | 2013 |
| Recrystallization as a nucleation mechanism for whiskers and hillocks on thermally cycled Sn-alloy solder films P Sarobol, JP Koppes, WH Chen, P Su, JE Blendell, CA Handwerker Materials Letters 99, 76-80, 2013 | 26 | 2013 |
| Effect of crystallographic texture, anisotropic elasticity, and thermal expansion on whisker formation in β-Sn thin films WH Chen, P Sarobol, JR Holaday, CA Handwerker, JE Blendell Journal of Materials Research 29, 197-206, 2014 | 24 | 2014 |
| Spontaneous formation of ordered nanobubbles in anodic tungsten oxide during anodization WH Chen, MY Lai, KT Tsai, CY Liu, YL Wang The Journal of Physical Chemistry C 115 (38), 18406-18411, 2011 | 20 | 2011 |
| A predictive model for whisker formation based on local microstructure and grain boundary properties P Sarobol, Y Wang, WH Chen, AE Pedigo, JP Koppes, JE Blendell, ... JOM 65 (10), 1350-1361, 2013 | 13 | 2013 |
| Local variations in grain formation, grain boundary sliding, and whisker growth along grain boundaries in large-grain Sn films WH Chen, C Wang, P Sarobol, J Blendell, C Handwerker Scripta Materialia 187, 458-463, 2020 | 7 | 2020 |
| Heterogeneous Stress Relaxation Processes at Grain Boundaries in High-Sn Solder Films: Effects of Sn Anisotropy and Grain Geometry During Thermal Cycling WH Chen, P Sarobol, CA Handwerker, JE Blendell JOM 68 (11), 2888-2899, 2016 | 6 | 2016 |
| Evaluation of local anisotropic elasticity and thermal expansion on whisker formation sites in beta-tin thin films WH Chen PURDUE UNIVERSITY, 2014 | 1 | 2014 |
| Whisker Formation and Stress Relaxation in Tin Thin Films P Sarobol, A Pedigo, J Koppes, Y Wang, W Chen, P Su, J Blendell, ... Microscopy and Microanalysis 17 (S2), 1846-1847, 2011 | 1 | 2011 |
| Quantitative Assessment of Stress Relaxation in Tin Films by the Formation of Whiskers, Hillocks, and Other Surface Defects NG Clore, DD Fritz, WH Chen, ME Williams, JE Blendell, CA Handwerker Mitigating Tin Whisker Risks: Theory and Practice, 187-214, 2016 | | 2016 |
| Effects of Grain Misorientation & Strain Distribution on Whisker Formation on Electroplated Sn-Cu films C Handwerker, P Sarobol, WH Chen, P Su, J Blendell AIP Conference Proceedings, 2012 | | 2012 |
| Tin Whisker and Hillock Formation on Thermally Cycled, Large Grained Pb-Free Solder Alloy Films J Koppes, P Sarobol, WH Chen, P Su, J Blendell, C Handwerker AIP Conference Proceedings, 2012 | | 2012 |
| Representation in 3 D and Stress Response of Tin Whiskers B Anglin, P Sarobol, A Pedigo, WH Chen, R Lebensohn, J Blendell, ... Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box …, 2012 | | 2012 |
| Heterogeneous Stress Relaxation in Thin Films: Whiskers, Hillocks, and Beyond CA Handwerker, J Blendell, WH Chen, P Sarobol, Y Wang | | |
