受强制性开放获取政策约束的文章 - Jeffrey C. Suhling了解详情
无法在其他位置公开访问的文章：102 篇
Evolution of the cyclic stress-strain and constitutive behaviors of doped lead free solder during fatigue testing
MA Hoque, MM Chowdhury, N Fu, JC Suhling, P Lall
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018
强制性开放获取政策： US National Science Foundation
Fatigue properties of lead-free doped solder joints
S Su, FJ Akkara, M Abueed, M Jian, J Suhling, P Lall
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018
强制性开放获取政策： US National Science Foundation
Effect of Prolonged Storage up to 1-Year on the High Strain Rate Properties of SAC Leadfree Alloys at Operating Temperatures up to 200° C
P Lall, D Zhang, V Yadav, J Suhling, D Locker
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1219-1230, 2017
强制性开放获取政策： US National Science Foundation
Effect of shock angle on solder-joint reliability of potted assemblies under high-G shock
P Lall, ARR Pandurangan, K Dornala, J Suhling, J Deep
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020
强制性开放获取政策： US National Science Foundation
Microstructural evolution in SAC+ X solders subjected to aging
J Wu, JC Suhling, P Lall
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1087-1098, 2019
强制性开放获取政策： US National Science Foundation, US Department of Defense
Investigation of Aging Induced Microstructural Changes in Doped SAC+ X Solders
J Wu, S Ahmed, JC Suhling, P Lall
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019
强制性开放获取政策： US National Science Foundation, US Department of Defense
Anand Parameters for Modeling Prolonged Storage on High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder at High Operating Temperature
P Lall, V Yadav, J Suhling, D Locker
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 448-459, 2018
强制性开放获取政策： US National Science Foundation
High strain rate mechanical behavior of SAC-Q solder
P Lall, V Yadav, J Suhling, D Locker
2017 16th IEEE intersociety conference on thermal and thermomechanical …, 2017
强制性开放获取政策： US National Science Foundation
High strain rate mechanical properties of SAC-Q solder for extreme temperatures after exposure to isothermal aging up to 90 days
P Lall, V Mehta, J Suhling, K Blecker
Journal of Electronic Packaging 144 (2), 021108, 2022
强制性开放获取政策： US National Science Foundation
Quantification and modeling of microstructural evolution in lead free solders during long term isothermal aging
S Ahmed, J Wu, N Fu, JC Suhling, P Lall
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 162-171, 2018
强制性开放获取政策： US National Science Foundation, US Department of Defense
Non-Perpendicular High-G Shock on Potted Fine Pitch Electronics Under Sustained High Temperature Aging
P Lall, AR Ram, J Suhling, J Deep
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021
强制性开放获取政策： US National Science Foundation
Evaluation of aging induced microstructural evolution in lead free solders using scanning probe microscopy
S Ahmed, JC Suhling, P Lall
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018
强制性开放获取政策： US National Science Foundation
Evolution of high strain rate and high temperature mechanical properties of SAC305 with long term storage up to 1-year
P Lall, D Zhang, J Suhling, D Locker
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017
强制性开放获取政策： US National Science Foundation
High Strain-Rate Properties for SAC305 at Cold Operating Temperatures down to-65° C
P Lall, V Mehta, J Suhling, K Blecker
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020
强制性开放获取政策： US National Science Foundation
3-D numerical multiphysics model for Cu-Al wire bond corrosion
P Lall, Y Zhang, J Suhling, L Nguyen
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019
强制性开放获取政策： US National Science Foundation
Nanoindentation measurements of the mechanical properties of individual phases within lead free solder joints subjected to isothermal aging
A Fahim, S Ahmed, JC Suhling, P Lall
International Electronic Packaging Technical Conference and Exhibition 51920 …, 2018
强制性开放获取政策： US National Science Foundation
Effect of 100° C Aging for Periods of up to 120-days on High Strain Rate Properties of SAC305 Alloys
P Lall, V Mehta, J Suhling, K Blecker
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020
强制性开放获取政策： US National Science Foundation
Stress Strain Analysis on Stitch Bond of Cu-Al Wirebonds Using X-ray Micro-CT Technique
P Lall, M Kasturi, J Suhling, D Lockers
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019
强制性开放获取政策： US National Science Foundation
Evolution of the Mechanical Properties of Lead Free Solder Joints Subjected to Mechanical Cycling
MA Hoque, MM Chowdhury, JC Suhling, P Lall
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019
强制性开放获取政策： US National Science Foundation
Evolution of Anand Parameters for SAC-Q Solder Alloy after Prolonged Storage up to 1-Year at High Strain Rate at Very High Operating Temperature
P Lall, V Yadav, J Suhling, D Locker
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019
强制性开放获取政策： US National Science Foundation
出版信息和资助信息由计算机程序自动确定