| A monolithic inkjet print head: DomeJet SW Lee, HC Kim, K Kuk, YS Oh Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro …, 2001 | 59 | 2001 |
| Bubble-jet type ink-jet printhead and manufacturing method thereof D Maeng, K Kuk, Y Oh, H Kim, SW Lee US Patent 6,561,625, 2003 | 49 | 2003 |
| Magnetic cooling apparatus JH Kim, IJ Mun, WH Choi, YD Ko, K Kuk, MS Kim US Patent 9,964,344, 2018 | 48 | 2018 |
| Magnetic cooling apparatus WH Choi, IJ Mun, K Kuk, MS Kim US Patent 9,599,375, 2017 | 48 | 2017 |
| Magnetic regenerator unit and magnetic cooling system with the same JH Kim, IH Park, K Kuk, WH Choi US Patent 10,030,895, 2018 | 43 | 2018 |
| Refrigerator and vacuum insulation panel thereof HK Jeong, DH Kim, K Kuk, JO Kim, CH Jang, MS Kim US Patent 10,274,247, 2019 | 42 | 2019 |
| Monolithic ink-jet printhead having a heater disposed between dual ink chambers and method for manufacturing the same H Song, Y Oh, J Park, K Kuk, C Lee, YJ Kim, JH Lim US Patent 7,018,017, 2006 | 41 | 2006 |
| Refrigerator DW Kim, K Kuk, TH Song, S Youn, K Wonkyeong, K Pilseong, Y Inseok, ... US Patent 9,696,083, 2017 | 35 | 2017 |
| Refrigerator and vacuum insulation module thereof HK Jeong, DH Kim, CH Jang, K Kuk, JO Kim US Patent 11,047,616, 2021 | 34 | 2021 |
| Self-standing and shape-memorable UV-curing epoxy polymers for three-dimensional (3D) continuous-filament printing H Sun, Y Kim, YC Kim, IK Park, J Suhr, D Byun, HR Choi, K Kuk, OH Baek, ... Journal of Materials Chemistry C 6 (12), 2996-3003, 2018 | 33 | 2018 |
| Monolithic ink-jet printhead H Kim, Y Oh, K Kuk, KJ Yoon, J Min, S Lee, C Lee, SS Baek, SW Lee, ... US Patent 6,692,112, 2004 | 30 | 2004 |
| Refrigerator MS Kim, CH Jang, K Kuk US Patent 10,852,054, 2020 | 27 | 2020 |
| Method of manufacturing monolithic ink-jet printhead Y Park, SW Lee, J Min, S Cho, K Kuk US Patent 6,806,108, 2004 | 27 | 2004 |
| Magnetic cooling apparatus and magnetic refrigerating system having the same IJ Mun, MS Kim, WH Choi, K Kuk, JH Kim, HW Yu US Patent 10,281,176, 2019 | 26 | 2019 |
| Circuit element package, manufacturing method thereof, and manufacturing apparatus thereof K Kuk, KO Young-Dae, OH Beak, EB Han, H Kim, YK Jung, I Mun US Patent 10,566,293, 2020 | 25 | 2020 |
| Method of manufacturing a bubble-jet type ink-jet printhead D Maeng, K Kuk, Y Oh, H Kim, SW Lee US Patent 6,868,605, 2005 | 23 | 2005 |
| Development of the new thermal inkjet head on SOI wafer KD Bae, SS Baek, HT Lim, K Kuk, KC Ro Microelectronic engineering 78, 158-163, 2005 | 20 | 2005 |
| High-density ink-jet printhead having a multi-arrayed structure D Maeng, Y Oh, SH Lee, K Kuk US Patent 6,652,077, 2003 | 20 | 2003 |
| Semiconductor package and method of manufacturing the same OH Beak, K Kuk, YC Ko, W Kim US Patent 10,937,738, 2021 | 19 | 2021 |
| Apparatus and method for fabricating a color filter MS Kim, S Shin, S Kim, S Baek, Y Lee, K Kuk US Patent 7,775,179, 2010 | 19 | 2010 |
