| Mechanical characterization of micro/nanoscale structures for MEMS/NEMS applications using nanoindentation techniques X Li, B Bhushan, K Takashima, CW Baek, YK Kim Ultramicroscopy 97 (1-4), 481-494, 2003 | 393 | 2003 |
| Measurement of the mechanical properties of electroplated gold thin films using micromachined beam structures CW Baek, YK Kim, Y Ahn, YH Kim Sensors and Actuators A: Physical 117 (1), 17-27, 2005 | 191 | 2005 |
| Chemical mechanical polishing by colloidal silica-based slurry for micro-scratch reduction Y Ahn, JY Yoon, CW Baek, YK Kim Wear 257 (7-8), 785-789, 2004 | 136 | 2004 |
| The SiOG-based single-crystalline silicon (SCS) RF MEMS switch with uniform characteristics JM Kim, JH Park, CW Baek, YK Kim Journal of microelectromechanical systems 13 (6), 1036-1042, 2004 | 85 | 2004 |
| Direct nanomechanical machining of gold nanowires using a nanoindenter and an atomic force microscope X Li, P Nardi, CW Baek, JM Kim, YK Kim Journal of Micromechanics and Microengineering 15 (3), 551, 2004 | 80 | 2004 |
| A V-band micromachined 2-D beam-steering antenna driven by magnetic force with polymer-based hinges CW Baek, S Song, JH Park, S Lee, JM Kim, W Choi, C Cheon, YK Kim, ... IEEE transactions on microwave theory and techniques 51 (1), 325-331, 2003 | 77 | 2003 |
| Circular/linear polarization reconfigurable antenna on simplified RF-MEMS packaging platform in K-band TJ Jung, IJ Hyeon, CW Baek, S Lim IEEE transactions on antennas and propagation 60 (11), 5039-5045, 2012 | 73 | 2012 |
| Packaging for RF MEMS devices using LTCC substrate and BCB adhesive layer KIL Kim, JM Kim, JM Kim, GC Hwang, CW Baek, YK Kim Journal of micromechanics and microengineering 16 (1), 150, 2005 | 67 | 2005 |
| A new micromachined overlay CPW structure with low attenuation over wide impedance ranges and its application to low-pass filters HT Kim, S Jung, JH Park, CW Baek, YK Kim, Y Kwon IEEE Transactions on microwave theory and techniques 49 (9), 1634-1639, 2001 | 55 | 2001 |
| Effect of mechanical process parameters on chemical mechanical polishing of Al thin films W Cho, Y Ahn, CW Baek, YK Kim Microelectronic engineering 65 (1-2), 13-23, 2003 | 46 | 2003 |
| 2-D mechanical beam steering antenna fabricated using MEMS technology CW Baek, S Song, C Cheon, YK Kim, Y Kwon 2001 IEEE MTT-S International Microwave Sympsoium Digest (Cat. No. 01CH37157 …, 2001 | 43 | 2001 |
| Continuous anti-stiction coatings using self-assembled monolayers for gold microstructures JM Kim, CW Baek, JH Park, DS Shin, YS Lee, YK Kim Journal of Micromechanics and Microengineering 12 (5), 688, 2002 | 40 | 2002 |
| Electrostatically driven low-voltage micromechanical RF switches using robust single-crystal silicon actuators JM Kim, S Lee, JH Park, CW Baek, Y Kwon, YK Kim Journal of Micromechanics and Microengineering 20 (9), 095007, 2010 | 33 | 2010 |
| Thermal frequency reconfigurable electromagnetic absorber using phase change material H Jeong, JH Park, YH Moon, CW Baek, S Lim Sensors 18 (10), 3506, 2018 | 31 | 2018 |
| Millimeter-wave substrate integrated waveguide using micromachined tungsten-coated through glass silicon via structures IJ Hyeon, CW Baek Micromachines 9 (4), 172, 2018 | 27 | 2018 |
| V-band end-fire radiating planar micromachined helical antenna using through-glass silicon via (TGSV) technology AH Naqvi, JH Park, CW Baek, S Lim IEEE Access 7, 87907-87915, 2019 | 26 | 2019 |
| Performance of RF MEMS switches at low temperatures HT Su, I Llamas-Garro, MJ Lancaster, M Prest, JH Park, JM Kim, CW Baek, ... Electronics Letters 42 (21), 1219-1220, 2006 | 25 | 2006 |
| Novel micromachined coplanar waveguide transmission lines for application in millimeter-wave circuits JH Park, CW Baek, S Jung, HT Kim, Y Kwon, YK Kim Japanese Journal of Applied Physics 39 (12S), 7120, 2000 | 25 | 2000 |
| Deformation characteristics of electroplated MEMS cantilever beams released by plasma ashing TJ Kang, JG Kim, JH Kim, KC Hwang, BW Lee, CW Baek, YK Kim, ... Sensors and actuators a: physical 148 (2), 407-415, 2008 | 23 | 2008 |
| Fabrication of polarization-insensitive, multi-resonant metamaterial absorber using wafer bonding of glass dielectric substrate DH Lee, K Ling, S Lim, CW Baek Microelectronic Engineering 136, 42-47, 2015 | 22 | 2015 |
